Instrumentation Chassis Bridge Board Bypassing Backplane
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Solution Overview
Problem
Conventional modular instrumentation frameworks, such as PXIe, face limitations in high-speed interconnects among modules due to restricted front panel space, insufficient lane speed, and protocol-specific backplane connections, which hinder high-speed data transmission and flexibility across different communication standards.
Innovation Solution
The introduction of a protocol agnostic bridge board that provides high-speed connections between modules, bypassing the backplane, using differential pair or mixed signal connections, enabling flexible and high-speed data transfer regardless of the communication protocol, with configurations that accommodate various module arrangements and protocols.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If standard backplane PCIe connections are used, then protocol compatibility is maintained, but data transmission speed is limited to 8 Gbps per lane
Solution Approach 1:
The system segments the interconnect function by introducing a separate bridge board that handles high-speed differential pair connections independently from the standard PCIe backplane. This allows high-speed data transmission through the bridge board while the backplane maintains protocol compatibility, resolving the contradiction between speed and adaptability.
Solution Approach 2:
The bridge board acts as an intermediary component between modules, providing high-speed differential pair connections that bypass the protocol-specific backplane. This intermediary enables high-speed transmission without compromising the protocol compatibility maintained by the standard PCIe backplane.
2Ease of operation
If front panel interconnects are used, then user accessibility is improved, but available space is extremely limited
Solution Approach 1:
The solution moves the high-speed interconnect interface from the two-dimensional front panel to the three-dimensional interior space of the chassis. The bridge board is mounted inside the chassis and connects to modules through rear panel connectors, utilizing unused interior volume and eliminating front panel space constraints.
3Adaptability or versatility
If carrier-to-mezzanine connections are used, then module spacing is fixed, but flexibility in module arrangement is reduced
Solution Approach 1:
The bridge board provides universal high-speed connectivity that works with any module arrangement. The differential pair connections can be configured to connect any combination of modules, making the system versatile while maintaining relatively simple connection configuration through standardized connectors.
Data Source
AI summary
An instrumentation chassis includes a backplane, multiple peripheral slots located on the backplane and configured to receive insertable peripheral modules, respectively, and at least one protocol agnostic high speed connection mounted on, but not electrically connected to the backplane. The high speed connection is configured to interconnect at least two peripheral modules in corresponding peripheral slots of the multiple peripheral slots, bypassing the backplane.