Bridge Cards for High-Density Switch Fabric Airflow

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

High connectivity platforms face challenges in achieving desired connector density, signal integrity, and thermal cooling due to increased channel density and data rates, which lead to limited airflow and mechanical issues, such as pre-heated air affecting switch-fabric cards and restricted component density.

Innovation Solution

The introduction of bridge cards that couple port cards to switch-fabric cards in a three-dimensional configuration, maximizing airflow and interconnects while minimizing mechanical registration issues and optimizing routing, thereby creating a high-density, efficient cooling system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the number of backplane routing layers is increased to connect port cards with switch-fabric cards, then routing connectivity is improved, but signal integrity deteriorates due to increased distance and pin density

Engineering Contradiction:
Improverouting connectivityVSAvoidsignal integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent transitions from a traditional two-dimensional backplane routing architecture to a three-dimensional architecture by introducing vertically oriented bridge cards that extend upward from the backplane. This vertical dimension allows direct connections between port cards and switch-fabric cards without requiring signals to travel through multiple horizontal routing layers, thereby maintaining signal integrity while achieving high connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If channel density and data rates are increased, then connectivity capacity is improved, but thermal cooling becomes insufficient due to limited airflow

Engineering Contradiction:
Improveconnectivity capacityVSAvoidthermal cooling
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent segments the platform architecture into distinct functional zones by introducing bridge cards that create vertical separation between high-density routing areas and airflow channels. This segmentation allows cooling airflow to pass through dedicated vertical corridors without being blocked by dense horizontal routing layers, enabling effective thermal management alongside high connectivity capacity.

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If connector density is increased to accommodate more channels, then connectivity is improved, but mechanical registration issues worsen

Engineering Contradiction:
Improveconnector densityVSAvoidmechanical registration issues
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The bridge cards serve as intermediary components between the backplane and the card-edge connectors. They provide a stable, vertically-oriented connection point that simplifies the mechanical registration process by reducing the number of simultaneous alignment requirements between port cards and switch-fabric cards, thereby enabling high connector density without proportionally increasing mechanical complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9039432B2System and method for high connectivity platform
Publication Date: 2015.05.26 CISCO TECHNOLOGY INC
  • US9039432B2 patent drawing
  • US9039432B2 patent drawing
  • US9039432B2 patent drawing

AI summary

A system comprises a plurality of port cards arranged along a first orientation, the port cards operable to receive data from one or more nodes on a network. The system also comprises a plurality of switch-fabric cards arranged along a second orientation orthogonal to the first orientation, the switch-fabric cards operable to route data between the one or more port cards based on one or more rules. The system further comprises a plurality of bridge cards coupling the one or more port cards to the one or more switch-fabric cards, the bridge cards arranged physically between the port cards and switch-fabric cards.