Bridge Carrier 3DIC Packaging With Direct Die Bonding
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in efficiently integrating and connecting multiple dies in three-dimensional integrated circuits (3DICs) due to misalignment issues and high fabrication costs, which affect yield and reliability.
Innovation Solution
A semiconductor device manufacturing process involving a bridge carrier with a bridge redistribution structure that electrically connects multiple dies using a hybrid bonding process, reducing the need for additional bridge dies and simplifying the packaging structure, while using encapsulants and bonding layers to enhance connectivity and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bridge die structures are used to connect multiple dies, then electrical connection between dies is achieved, but device complexity and fabrication cost increase due to additional bridge dies and misalignment issues
Solution Approach 1:
The patent removes the intermediate bridge die from the traditional three-die structure (die1-bridge die-die2). Instead, die1 and die2 are directly bonded together through a singulation groove, extracting the unnecessary bridge component and simplifying the overall packaging structure while maintaining electrical connectivity.
Solution Approach 2:
The patent merges the functions of the bridge die with the direct die-to-die bonding interface. The singulation groove structure integrates both the electrical connection function and the mechanical support function into a single unified structure, eliminating the need for a separate bridge die component.
2Reliability
If multiple bridge dies are used to connect dies in 3DICs, then electrical connectivity is improved, but manufacturing precision deteriorates due to misalignment issues
Solution Approach 1:
By removing the intermediate bridge die, the patent eliminates the additional alignment interface that would be required between the bridge die and the endpoint dies. The direct bonding approach requires only one alignment operation between die1 and die2, significantly reducing cumulative misalignment errors.
3Reliability
If traditional packaging structures with bridge dies are used, then die connection is achieved, but fabrication cost increases
Solution Approach 1:
The patent eliminates the bridge die component and its associated fabrication, packaging, and testing processes. This reduction in component count and process steps directly lowers material costs, manufacturing complexity, and overall fabrication expenses.
Solution Approach 2:
The singulation groove structure is designed to be formed and then removed or collapsed after serving its purpose as a temporary bonding interface during fabrication. This allows the use of a simple, low-cost structure that fulfills its function temporarily and is then discarded, avoiding the need for expensive permanent bridge dies.
Data Source
AI summary
A semiconductor device includes a bridge carrier, a first die, a second die, a first encapsulant, a cap carrier, a third die, and a second encapsulant. The bridge carrier includes a carrier substrate and a bridge redistribution structure disposed on the carrier substrate. The first die and the second die are disposed side by side on the bridge carrier. The bridge redistribution structure electrically connects the first die and the second die. The first encapsulant laterally encapsulates the first die and the second die. The cap carrier is disposed over the first die and the second die. The third die is located between the first die and the cap carrier. The second encapsulant laterally encapsulates the third die.