Bridge Chip Package Layout for Shorter Signal Paths and Heat Dissipation
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high integration, miniaturization, and reliability, particularly in efficiently connecting multiple semiconductor chips and managing heat dissipation.
Innovation Solution
The semiconductor package incorporates a bridge chip with distinct regions, allowing for the electrical connection of an upper semiconductor chip to conductive posts through the bridge chip, thereby reducing signal path length and enhancing integration and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If semiconductor chips are connected using traditional bonding wires or bumps on a PCB substrate, then electrical connection is achieved, but the signal path length becomes excessive and integration density is reduced
Solution Approach 1:
The patent transitions from a planar PCB mounting arrangement to a three-dimensional stacked configuration where semiconductor chips are vertically positioned on support posts. This dimensional change allows signals to travel shorter vertical distances through conductive posts rather than long horizontal paths across a PCB, thereby reducing signal path length while increasing integration density through vertical stacking.
Solution Approach 2:
The patent introduces support posts as intermediary structures that hold semiconductor chips at elevated positions. These posts serve as mediators between the PCB substrate and the chips, enabling direct vertical electrical connections through conductive posts while maintaining spatial separation and reducing signal path length compared to traditional flat PCB connections.
2Reliability
If multiple semiconductor chips are mounted on a PCB substrate, then high integration is achieved, but heat dissipation becomes difficult and reliability decreases
Solution Approach 1:
The patent segments the integrated package into vertically stacked modules, each consisting of a semiconductor chip mounted on a support post. This segmentation allows independent thermal management for each chip module, enabling more effective heat dissipation pathways compared to densely packed planar arrangements where heat accumulates on the PCB substrate.
Solution Approach 2:
By arranging chips vertically in three dimensions rather than horizontally on a two-dimensional PCB, the patent creates additional thermal pathways through the vertical stack. Heat can dissipate through the support posts and conductive connections to the PCB, improving overall heat dissipation efficiency and reducing operating temperatures for higher reliability.
3Area of stationary object
If semiconductor packages are miniaturized, then integration density increases, but manufacturing precision and assembly difficulty increase
Solution Approach 1:
The support posts are pre-formed structures that automatically provide mechanical support and positioning for the semiconductor chips. The posts' fixed dimensions and positions serve as self-aligning fixtures, reducing the precision requirements for chip placement compared to direct mounting on a flat PCB substrate, thereby facilitating miniaturization while maintaining manufacturability.
Data Source
AI summary
A semiconductor package includes: a first substrate; a bridge chip disposed on the first substrate and having a first region and a second region; an upper semiconductor chip disposed on the first region of the bridge chip; and conductive posts disposed on the second region of the bridge chip and spaced apart from the upper semiconductor chip, wherein the upper semiconductor chip is electrically connected to the conductive posts through the bridge chip.