Bridge Chip Signal Routing for Semiconductor Data Transfer Latency
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Solution Overview
Problem
The existing semiconductor devices experience latency and reduced data transfer rates due to the bridge chip's signal processing, leading to inefficient bus usage and prolonged operation times as memory chips execute standard-defined operations, causing unnecessary waiting for the host.
Innovation Solution
The semiconductor device incorporates a bridge chip that can switch between two operation modes based on a specific signal, allowing it to interpret subsequent signals as intended for itself during a bridge control period, preventing unintended operations in memory chips and enabling faster data transfer by bypassing the memory chip's execution time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bridge chip processes signals according to standard-defined operations, then the memory chips can execute commands correctly, but the data transfer rate decreases due to latency and prolonged operation times
Solution Approach 1:
The bridge chip dynamically switches between two operation modes based on the received signal type: standard operation mode for normal memory chip commands and bridge control mode for host-directed commands. This dynamic adaptability allows the system to optimize performance by bypassing unnecessary execution steps when the host intends to control the bridge chip directly, thereby resolving the contradiction between reliable command execution and high data transfer rates
2Adaptability or versatility
If the memory chips execute commands meant for the bridge chip, then all commands are processed, but unnecessary waiting time occurs for the host
Solution Approach 1:
The bridge chip uses the ready/busy signal as feedback to determine whether to execute a command or pass it through to memory chips. When the bridge chip is busy processing host control commands, it sets the ready/busy signal to indicate busy state, preventing the host from issuing additional commands and eliminating unnecessary waiting time. This feedback mechanism ensures that commands are processed in the correct order without redundant execution delays
Data Source
AI summary
A semiconductor device includes a terminal group configured to receive a first signal and a second signal from a host, a first chip electrically connected to the terminal group, and a second chip electrically connected to the terminal group. The first chip is configured to, in response to reception of the first signal, transmit a third signal corresponding to the first signal to the second chip. The first chip is configured to, when the first chip has received the second signal before the first signal, refrain from transmitting the third signal to the second chip.