Bridge-Chip Semiconductor Package for Thin High-Reliability Stacking
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Solution Overview
Problem
The challenge is to create a semiconductor package with a small thickness while maintaining high data processing capacity and reliability, particularly for portable devices, where conventional semiconductor packages face limitations in miniaturization and weight reduction.
Innovation Solution
The solution involves a semiconductor package design where a first chip and a second chip are connected through a bridge chip via direct bonding, using a first oxide film and a first dielectric film instead of a molding member and substrate, with a second carrier substrate acting as a heat dissipation member to enhance thermal characteristics and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional semiconductor packages are used, then reliability is maintained, but thickness and weight cannot be reduced sufficiently
Solution Approach 1:
The patent extracts and removes the traditional molding member and substrate from the semiconductor package structure. By eliminating these conventional components, the package thickness is significantly reduced while the essential protective and structural functions are redistributed to remaining components like the bridge chip and dielectric films.
Solution Approach 2:
The patent changes the structural parameters of the package by transitioning from a traditional multi-layer structure to a simplified configuration where chips are directly bonded to the bridge chip. This parameter change enables thickness reduction while maintaining reliability through direct electrical and mechanical connections.
2Volume of stationary object
If miniaturization is pursued, then volume is reduced, but thermal management becomes more difficult
Solution Approach 1:
The bridge chip serves multiple functions simultaneously: it provides electrical interconnection between chips, structural support for the package, and thermal management through its heat dissipation function. This multi-functionality allows the package to achieve miniaturization while maintaining effective thermal characteristics.
Solution Approach 2:
The bridge chip acts as an intermediary component that mediates between the heat-generating chips and the external environment. By positioning the bridge chip as a thermal intermediary with good heat dissipation properties, the package achieves compact volume while managing thermal characteristics effectively.
3Device complexity
If direct bonding is used to connect chips, then manufacturing complexity is reduced, but precision requirements increase
Solution Approach 1:
The patent segments the package into distinct functional modules (chips, bridge chip, dielectric films) that can be independently fabricated and then directly bonded. This segmentation simplifies the overall manufacturing process by allowing parallel fabrication of components while reducing the need for complex assembly steps, though it does require precise bonding alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a thin semiconductor package with improved reliability and thermal management, enabling efficient data processing in compact form factors, thus addressing the need for miniaturization and weight reduction in portable devices.
Implementation Method 1
thermal characteristics and reliability are enhanced by utilizing a second carrier substrate as a heat dissipation member
Implementation Method 2
a first chip and a second chip are connected to a bridge chip through direct bonding
Data Source
AI summary
A semiconductor package according to an embodiment includes a first semiconductor chip, a second semiconductor chip, a first dielectric film surrounding the first semiconductor chip and the second semiconductor chip; first vias; second vias; a bridge chip; a second dielectric film surrounding the bridge chip and having an upper surface and a lower surface opposite to the upper surface; and a third via, some of the first vias are electrically connected to some of the bridge chip pads, some of the second vias are electrically connected to others of the bridge chip pads, and the passivation layer includes a same material as a material of the first dielectric film.