Bridge-Coupled Power Module Layout for Short Current Paths
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Solution Overview
Problem
Existing power supply solutions for data centers and intelligent ICs face challenges in achieving high power density, efficiency, and flexibility while minimizing footprint and signal interference, and are costly to develop and implement.
Innovation Solution
A power supply system with a bridge member that includes passive elements like inductors and capacitors, allowing for power coupling between packages on a system board, optimizing the bridge member for efficient power transmission and reducing the number of packages needed, thereby enhancing flexibility and reducing development costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If existing horizontal power supply solution is used, then current can be transmitted to load, but current transmission path is long and occupies much space of customer board
Solution Approach 1:
The patent transitions from a horizontal power supply architecture to a vertical stacked architecture. The power supply module is positioned vertically above the load chip on the customer board, creating a three-dimensional stacked configuration. This dimensional change dramatically shortens the current transmission path from horizontal traces across the board to vertical connections through stacked interfaces, while also reducing the footprint occupied on the customer board surface.
2Length of stationary object
If existing vertical power supply solution is used, then current transmission path is shortened, but it passes through signal terminal region and interferes with signal
Solution Approach 1:
The patent segments the power supply system into distinct functional modules: a power supply module containing switching devices and passive elements, and a load chip, connected through a standardized stacked interface. This segmentation allows the power supply module to be positioned vertically above the load chip with dedicated power terminals, separating power transmission paths from signal terminal regions and eliminating signal interference while maintaining short current paths.
3Power
If more packages are used to achieve high power density, then power output capability increases, but footprint on customer board increases
Solution Approach 1:
The patent merges multiple power supply functions into a single integrated power supply module. Multiple switching devices (first and second switching devices) and passive elements (inductors, capacitors) are combined within one module that connects to the load chip through a single stacked interface. This consolidation achieves high power output capability while minimizing the footprint on the customer board, as the entire power supply functionality is contained in one vertically-stacked module rather than requiring multiple separate packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high efficiency, flexibility, and reduced costs by optimizing the bridge member for power coupling, improving power density, and minimizing footprint, while reducing signal interference and simplifying development processes.
Implementation Method 1
a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package
Data Source
AI summary
A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.