Passive Bridge Coupling for Surface Emitters With Lower Crosstalk
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Solution Overview
Problem
Bond wires connecting high frequency signals to multiple transducers in integrated circuit chips are susceptible to crosstalk due to their unshielded nature, especially when closely spaced, which affects signal integrity and heat dissipation.
Innovation Solution
A passive bridge element is bottom-mounted to a printed circuit board next to a surface emitter chip, connecting device contacts to board contacts via signal paths without active amplification, with optimized spacing and passive components to minimize crosstalk and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires are used to connect top surface contact pads to substrate, then connection reliability and cost are improved, but crosstalk between closely spaced wires increases
Solution Approach 1:
The patent introduces an intermediary shielding structure (ground plane or shield wire) between the bond wires and the contact pads on the IC chip surface. This mediator blocks the electromagnetic fields from interacting, thereby reducing crosstalk while maintaining the simplicity and reliability of bond wire connections.
Solution Approach 2:
The patent employs a thin film ground plane or shield layer positioned between the bond wires and the chip surface. This thin film structure provides electromagnetic shielding to prevent crosstalk while being flexible enough to accommodate the bond wire routing and maintain connection reliability.
2Ease of manufacture
If bond wires are used for connecting contact pads, then manufacturing simplicity and cost are improved, but heat dissipation is worsened
Solution Approach 1:
The patent merges the shielding function with the heat dissipation function by integrating a ground plane or shield structure that serves dual purposes: preventing crosstalk and providing a thermal pathway. The ground plane acts as both an electromagnetic shield and a heat sink, improving heat dissipation while maintaining manufacturing simplicity.
Solution Approach 2:
The patent employs composite structures combining conductive materials for both electromagnetic shielding and thermal conduction. The ground plane or shield wire is made from materials that provide both crosstalk reduction and enhanced heat dissipation, achieving multiple benefits simultaneously.
Data Source
AI summary
Techniques are provided for reducing crosstalk between bond wires coupling high frequency signals to multiple transducers in an integrated circuit (IC) chip. At least some of the techniques employ a bridge element configured to be bottom mounted to a printed circuit board next to a surface emitter chip. The bridge element may include: device contacts to each be bond wire connected to a respective anode contact of the surface emitter chip; board contacts to each be bond wire connected to a respective signal trace of the printed circuit board; and a signal path for each of the device contacts, the signal path connecting that device contact to a respective one of the board contacts without active amplification.