Bridge Die Cavity Interconnects for Dense Multichip Packaging
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Solution Overview
Problem
Conventional microelectronic packages face limitations in interconnect density, signal transfer speed, and miniaturization due to costly and complex manufacturing operations required for high-density interconnects.
Innovation Solution
The implementation of microelectronic structures with a substrate and a bridge component in a cavity, where the bridge component is coupled to the substrate using an adhesive, allowing for higher interconnect density without the need for expensive manufacturing operations, and enabling flexible design options without increased cost or complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional solder attachment methods are used to attach die to organic package substrate, then manufacturing process is well-established and reliable, but interconnect density is limited and manufacturing complexity increases for high-density interconnects
Solution Approach 1:
The package structure is segmented into distinct functional layers: organic package substrate, cavity structure, bridge component, and die. This segmentation allows each component to be optimized independently, enabling high interconnect density on the substrate without proportionally increasing overall manufacturing complexity.
Solution Approach 2:
The patent transitions from planar interconnect architecture to a three-dimensional structure with a cavity and bridge component. The cavity provides vertical space for routing interconnects, allowing higher interconnect density by utilizing the Z-dimension rather than only the X-Y plane.
2Speed
If high interconnect density is achieved through conventional methods, then signal transfer speed may be improved, but manufacturing cost and complexity increase significantly
Solution Approach 1:
The bridge component acts as an intermediary element between the organic package substrate and the die. It provides a platform for high-density interconnect routing within the cavity, enabling fast signal transfer without requiring the entire manufacturing process to be complex.
Solution Approach 2:
The cavity structure creates a nested arrangement where the bridge component is positioned within the cavity formed in the organic package substrate. This nesting allows interconnects to be routed through the cavity space, achieving high density without expanding the overall package footprint or requiring excessively complex external routing.
3Volume of moving object
If miniaturization is pursued to reduce package size, then performance may be enhanced, but achieving high interconnect density becomes more difficult with conventional approaches
Solution Approach 1:
By introducing the cavity dimension, the patent enables interconnect routing in three dimensions rather than two. This allows miniaturization of the package footprint while maintaining or increasing interconnect density, as connections can be routed vertically through the cavity and bridge structure rather than only laterally across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high interconnect densities comparable to conventional methods without the expense of costly operations, offering design flexibility and reduced manufacturing complexity, thereby enhancing the performance and efficiency of microelectronic packages.
Implementation Method 1
the bridge component is coupled to the substrate using an adhesive
Data Source
AI summary
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.