Bridge Die Connector Layout to Prevent Substrate Cracking

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Solution Overview

Problem

The challenge in 3D memory stack manufacturing is preventing the bridge die from cracking during the process, which affects yield and cost efficiency.

Innovation Solution

Incorporating dummy connectors made of metal, which are electrically isolated and laterally encapsulated, to stabilize the semiconductor substrate during grinding and planarization processes, ensuring even thickness and reducing cracking risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bridge die is used to connect with other dies in 3D memory stack, then the packaging performance is improved, but the risk of substrate cracking during manufacturing increases

Engineering Contradiction:

Improvepackaging performanceVSAvoidsubstrate cracking

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by forming dummy connectors before the grinding and planarization processes. These dummy connectors are positioned at locations where cracking is likely to occur during substrate thinning, providing pre-established stress distribution points that prevent catastrophic cracking during subsequent manufacturing steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The dummy connectors act as intermediaries between the active connectors and the substrate structure. They provide mechanical support and stress distribution in the substrate, particularly in regions where active connectors are spaced apart, preventing crack propagation during the grinding and planarization processes while maintaining the electrical isolation required for proper device operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the substrate is thinned during manufacturing, then the device integration is improved, but the thickness uniformity and structural stability deteriorate

Engineering Contradiction:

Improvedevice integrationVSAvoidthickness uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by placing dummy connectors at specific locations within the substrate where additional structural support is needed during thinning. Rather than uniformly distributing all connectors, the dummy connectors are strategically positioned in regions prone to stress concentration or thickness variation, providing localized reinforcement that maintains overall thickness uniformity while enabling aggressive substrate thinning for higher device integration.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250364462A1Integrated circuit structure, and method for forming thereof

Publication Date: 2025.11.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.