Die Interconnect Substrate Bridge Die Embedding
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Solution Overview
Problem
Current semiconductor package designs face challenges in reducing device size and cost due to large bump pitch between solder structures, which limits miniaturization and increases production expenses.
Innovation Solution
A method for forming a die interconnect substrate involves placing a bridge die in a multilayer substrate with lithographically defined via portions, reducing bump pitch by forming electrically conductive material in mask layer openings, and using a filler structure to stabilize the bridge die, allowing for smaller semiconductor devices and lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional solder structures with large bump pitch are used, then manufacturing process is simpler, but device size increases and production costs increase
Solution Approach 1:
The patent divides the interconnect structure into multiple segments: bridge dies with integrated interconnects are segmented and embedded within the multilayer substrate. This segmentation allows reduction of bump pitch while maintaining manufacturing feasibility through modular assembly of bridge dies and substrate layers
Solution Approach 2:
The patent transitions from planar interconnect布局 to three-dimensional embedding of bridge dies within substrate layers. By utilizing vertical stacking and embedding bridge dies at different levels, the design reduces lateral bump pitch while adding vertical dimensionality to the interconnect architecture
2Manufacturing precision
If bridge die is embedded in multilayer substrate, then bump pitch is reduced, but manufacturing process becomes more complex
Solution Approach 1:
Bridge dies are pre-fabricated with integrated interconnect structures before embedding in the multilayer substrate. This preliminary preparation of bridge dies with pre-formed interconnects simplifies the overall manufacturing process by separating die fabrication from substrate assembly operations
Solution Approach 2:
The patent introduces filler material as an intermediary substance to stabilize bridge dies during embedding and to fill gaps between bridge dies and substrate. This intermediary filler simplifies the manufacturing process by providing mechanical support and enabling easier integration of bridge dies into the multilayer structure
3Stability of the object's composition
If filler structure is added to stabilize bridge die, then device stability improves, but device complexity increases
Solution Approach 1:
The filler material is selected to have properties matching the surrounding substrate materials, creating a homogeneous interface between filler, bridge die, and substrate. This homogeneity provides stabilization without introducing significant structural complexity or material incompatibilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of smaller semiconductor devices with reduced bump pitch, leading to improved current carrying capabilities and lower production costs by minimizing the distance between solder structures and stabilizing the bridge die.
Implementation Method 1
removing portions of the mask layer to form openings exposing at least part of the first bridge die pad and the second bridge die pad by a lithographic process
Implementation Method 2
forming electrically conductive material in the openings of the mask layer to form a via portion on the first bridge die pad
Data Source
AI summary
A die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate comprises a multilayer substrate structure comprising a substrate interconnect, wherein the bridge die is embedded in the multilayer substrate structure. The die interconnect substrate comprises a via portion formed on the first bridge die pad of the bridge die. An average angle between a surface of the first bridge die pad and a sidewall of the via portion lies between 85° and 95°.