Bridge Die Over Embedded Interposer for EMIB Alignment and Power Loss
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Solution Overview
Problem
The integration of multiple IC dies in a semiconductor package faces challenges due to the complexity of aligning conductive features in an EMIB, as well as the inefficiency of power delivery from distant voltage regulators, leading to power loss and waste heat generation.
Innovation Solution
The use of an interposer coupled to an EMIB, where the interposer includes a redistribution layer to align conductive features even if they are not directly aligned, and incorporates power management functionality such as voltage regulation circuitry to minimize power loss and heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an EMIB is used to couple IC dies, then the integration of multiple IC dies is achieved, but the alignment of conductive features becomes complex
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the substrate and the EMIB. The interposer includes a first set of conductive features that couple to the substrate and a second set of conductive features that couple to the EMIB. This intermediary structure decouples the alignment requirements, allowing the EMIB conductive features to align with the interposer features rather than directly with the substrate features, thereby simplifying the overall alignment process while maintaining the ability to integrate multiple IC dies
2Ease of operation
If voltage regulators are placed distant from the EMIB, then the EMIB can be positioned optimally, but power delivery efficiency decreases due to longer current paths
Solution Approach 1:
The patent segments the power delivery function by placing voltage regulators on the interposer rather than on the substrate. This creates a localized power management system where the voltage regulators are positioned close to the EMIB on the interposer, shortening the current path and reducing power loss, while still allowing the EMIB to be positioned optimally for its functional requirements
3Ease of operation
If voltage regulators are placed distant from the EMIB, then the EMIB positioning is flexible, but waste heat generation increases
Solution Approach 1:
The patent segments the thermal management consideration by localizing the voltage regulators on the interposer near the EMIB. This segmentation of the power delivery system ensures that the heat-generating components (voltage regulators) are positioned close to the EMIB, reducing the distance over which heat must be managed and minimizing waste heat generation, while maintaining flexible EMIB positioning
Data Source
AI summary
A microelectronic assembly includes a substrate with a first substrate face and a second substrate face opposite the first substrate face. An interposer is in the substrate. The interposer has a first interposer face facing the first substrate face and a second interposer face facing the second substrate face. A bridge die is over the interposer. The bridge die has a first bridge die face facing the second interposer face and a second bridge die face facing the second substrate face. A first set of electrical connections is between the first bridge die face and the second interposer face, and a second set of electrical connections is between the first interposer face and the substrate. The second set of electrical connections has a greater number of electrical connections than the first set of electrical connections.