Bridge Die Package Layout to Prevent Solder Non-Wetting
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Solution Overview
Problem
Non-wetting issues with solder bumps in 2.5D semiconductor packages lead to reduced yield and integration challenges.
Innovation Solution
A semiconductor package design where a bridge semiconductor die is mounted directly onto overhanging portions of primary semiconductor dice via solder bumps, eliminating the need for precise alignment with substrate bumps, and using underfill layers to secure the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder bumps are used to mount semiconductor dice on substrate, then electrical connections are established, but non-wetting issues occur reducing yield
Solution Approach 1:
The patent introduces an underfill material as an intermediary substance between the solder bumps and the substrate/dice interfaces. This underfill material flows into and fills the gaps and voids around the solder bumps, providing mechanical support and ensuring complete wetting and adhesion. The underfill acts as a mediator that compensates for any non-wetting issues of the solder bumps themselves, thereby improving yield without compromising the electrical connection function.
2Productivity
If 2.5D semiconductor package structure is implemented, then integration level is improved, but non-wetting issues occur lowering yield
Solution Approach 1:
The patent applies preliminary action by pre-coating the substrate and/or dice surfaces with a solder paste or priming layer before mounting the semiconductor dice. This preliminary coating ensures that when the solder bumps are applied, they have optimal surface conditions for wetting and adhesion. Additionally, the underfill material is applied in advance or simultaneously with the mounting process to ensure it fills any gaps before the structure cools and contracts, preventing non-wetting issues and improving yield in the integrated 2.5D package structure.
3Adaptability or versatility
If multiple semiconductor dice are mounted on same side of substrate, then functionality is increased, but non-wetting issues occur reducing yield
Solution Approach 1:
The patent applies local quality by providing individual underfill material applications at each dice mounting location rather than a uniform approach. Each dice- substrate interface receives targeted underfill material that is specifically adapted to the local geometry, solder bump arrangement, and spacing of that particular dice. This localized underfill application ensures optimal wetting and adhesion at each specific mounting point, accommodating variations in functionality requirements while preventing non-wetting issues that would reduce yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves yield in mass production by preventing non-wetting issues and ensuring stable electrical connections between semiconductor dice.
Implementation Method 1
a first semiconductor die mounted on the first region via a first set of solder bumps and having a first overhanging portion above the opening; a second semiconductor die mounted on the second region via a second set of solder bumps
Implementation Method 2
an underfill layer filled between both of the first and second semiconductor dice and both of the package substrate and the bridge semiconductor die
Data Source
AI summary
A semiconductor package comprises: a package substrate having a first region, a second region and an opening between the first and second regions; a first semiconductor die mounted on the first region via a first set of solder bumps and having a first overhanging portion above the opening; a second semiconductor die mounted on the second region via a second set of solder bumps and having a second overhanging portion above the opening; a bridge semiconductor die mounted onto respective back surfaces of the first overhanging portion and the second overhanding portion via a third set of solder bumps, wherein the bridge semiconductor die is aligned with the opening; and an underfill layer filled between both of the first and second semiconductor dice and both of the package substrate and the bridge semiconductor die.