Embedded Bridge Die Trench Structures for Low-Inductance Power Delivery
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Solution Overview
Problem
Existing embedded multi-die interconnect bridge (EMIB) structures face challenges in power delivery due to high resistance and inductance issues, which affect signal bandwidth and noise in microelectronic packages.
Innovation Solution
The implementation of vertical conductive trench structures within the silicon interconnect bridge provides a short and effective current path, reducing resistance and inductance by enabling vertical power delivery directly from the substrate to the die, complementing horizontal power delivery paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power delivery paths are routed from bridge die to microelectronic package substrate, then power delivery is enabled, but resistance and inductance increase
Solution Approach 1:
The patent introduces vertical power delivery paths through the substrate thickness dimension, transitioning from traditional planar power routing to three-dimensional power delivery. Conductive trenches extend vertically from the substrate surface to the bridge die, creating direct power pathways that reduce the horizontal routing distance and associated parasitic effects.
Solution Approach 2:
The patent employs conductive trenches as intermediary structures that facilitate power transfer between the substrate and bridge die. These trenches act as dedicated power conduits, mediating the power delivery function and isolating it from signal routing paths, thereby reducing electromagnetic interference and parasitic coupling.
2Speed
If high I/O density is implemented in EMIB structures, then signal bandwidth increases, but power delivery challenges worsen
Solution Approach 1:
The patent segments the substrate into regions with dedicated conductive trenches for power delivery, separating power distribution functions from signal routing areas. This segmentation allows high I/O density in signal regions while maintaining stable power delivery through dedicated vertical pathways, preventing power delivery issues from limiting signal bandwidth performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces power noise and improves power delivery performance by shortening the pathway distance, lowering parasitic resistance and inductance, and enhancing voltage distribution, resulting in a 52% reduction in voltage drop and 37% reduction in power delivery loop inductance.
Implementation Method 1
a conductive material formed in the plurality of openings and on at least one of the plurality of conductive layers
Data Source
AI summary
Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.