Bridge Die Interconnect for High-Density Package Components
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Solution Overview
Problem
The increasing complexity of integrated circuit packages requires more efficient local communication and interconnection between neighboring device dies and packages, which existing technologies struggle to address effectively.
Innovation Solution
A bridge die is encapsulated in an encapsulant with a redistribution structure, including redistribution lines, to interconnect two package components, utilizing through-vias and metal pillars to establish a dense network of electrical connections, allowing for efficient interconnection between package components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional interconnection methods are used between package components, then the structure is simple, but the number of electrical connections is limited and wire pitch is large
Solution Approach 1:
The patent transitions from planar interconnection to three-dimensional vertical interconnection by stacking multiple device dies and interposer layers. Through-vias penetrate through the interposer substrate to establish vertical electrical pathways, enabling dense interconnection in the vertical dimension rather than relying solely on horizontal routing. This dimensional transition dramatically increases the number of electrical connections while reducing wire pitch.
Solution Approach 2:
The interposer substrate acts as an intermediary component between package components, providing a platform for dense interconnection. The interposer contains through-vias and conductive structures that mediate the electrical connection between upper and lower device dies, enabling high-density interconnection without requiring direct bonding between all component pairs. This intermediary structure resolves the contradiction by providing a scalable interconnection architecture.
2Length of moving object
If wire length is reduced for better performance, then signal transmission improves, but the available interconnection paths become more limited
Solution Approach 1:
By introducing vertical through-vias that penetrate the interposer substrate, the patent creates three-dimensional interconnection paths. This allows signals to travel vertically through the stack rather than requiring long horizontal routes across the package substrate. The vertical dimension provides direct, short pathways between upper and lower device dies, reducing wire length while maintaining flexibility through the organized array of through-via locations.
Solution Approach 2:
The interconnection path is segmented into multiple short segments: from the upper device die bond pad to the through-via, through the interposer vertically, and from the through-via to the lower device die bond pad. This segmentation replaces a single long horizontal wire with multiple short vertical and lateral segments, reducing total wire length while maintaining interconnection flexibility through the modular via structure.
Data Source
AI summary
A structure includes a bridge die. The bridge die includes a semiconductor substrate; and an interconnect structure over the semiconductor substrate. The interconnect structure includes dielectric layers and conductive lines in the dielectric layers, an encapsulant encapsulating the bridge die therein, and a redistribution structure over the bridge die. The redistribution structure includes redistribution lines therein. A first package component and a second package component are bonded to the redistribution lines. The first package component and the second package component are electrically interconnected through the redistribution lines and the bridge die.