Bridge Die Resin Layer Mounting to Prevent Warping and Cracking
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Solution Overview
Problem
Existing semiconductor manufacturing methods face issues with semiconductor dies being warped or cracked during handling due to thinning, particularly when suctioning and mounting, leading to insufficient bonding and void formation.
Innovation Solution
A method involving the use of a cured resin layer covering terminal electrodes on semiconductor substrates, allowing for reliable attachment by suctioning the resin layer for handling, which includes forming a resin layer using a curable resin composition, optionally with inorganic fillers, to prevent warping and cracking, and ensuring uniform thermal expansion coefficients for stable attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is suctioned by a collet at the outer periphery to avoid terminal electrodes, then the terminal electrodes are not damaged, but the semiconductor die may be warped or cracked due to thinning and the load is concentrated on the outer peripheral portion causing insufficient bonding or voids in the central portion
Solution Approach 1:
A resin layer is introduced as an intermediary substance covering the terminal electrodes on the semiconductor die. This resin layer serves as a mediator that allows the collet to suction the die without directly contacting the terminal electrodes, preventing electrode damage while distributing the suction load across the entire die surface including the central portion, thereby preventing warping and improving bonding reliability.
Solution Approach 2:
The resin layer acts as a flexible thin film that conforms to the semiconductor die surface and terminal electrodes. This thin film structure provides uniform support across the die during handling and mounting, distributing mechanical stresses and preventing concentration of loads that would cause warping or cracking of the thinned die.
2Length of moving object
If the semiconductor die is thinned to reduce size, then the device size is reduced, but the die becomes susceptible to warping and cracking during handling
Solution Approach 1:
The resin layer is applied beforehand to the semiconductor die before handling and mounting operations. This pre-applied resin layer acts as a cushioning layer that provides mechanical support and protection to the thinned die, distributing applied loads and preventing warping or cracking during subsequent processing steps.
Solution Approach 2:
The combination of the thinned semiconductor die and the resin layer forms a composite structure. The resin layer compensates for the reduced mechanical strength of the thinned die by providing additional structural support, creating a composite system that maintains both the size reduction benefit and the necessary mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures reliable attachment of semiconductor members without warping or cracking, facilitating easy formation and polishing of resin layers, and maintaining positional stability under thermal conditions.
Implementation Method 1
picking up the semiconductor member by suctioning a surface of the cured resin layer of the semiconductor member with a holding member
Data Source
Figure 1
Figure 2(a)~2(d)
Figure 3(a)~3(b)
AI summary
As an example of a method for manufacturing a semiconductor device, a method for mounting a bridge die 20 on a support such as a redistribution layer in a state where a connection terminal of the bridge die 20 faces upward (face-up) is disclosed. In this method, before forming an adhesive layer on a back surface of the bridge die, a resin layer 23 is formed so as to cover terminal electrodes 22 on a semiconductor substrate 21 of the bridge die 20 with a thermosetting resin film (e.g. DAF) or a thermosetting adhesive. Each bridge die 20 is mounted on the support such as a wiring layer 12 by vacuum-suctioning an entire surface of the cured resin layer 23 with a collet to manufacture a semiconductor device. According to this method, the entirety of a surface 23a can be suctioned when the bridge die 20 is suctioned by the collet C, it is possible to prevent the bride die from bending as compared with a method of suctioning only at the outer edge avoiding the terminal electrode. Further, it is possible to prevent chip cracking at the time of picking up a chip and generation of voids at the time of mounting the chips by thermal crimping.