Bridge Die Surface Orientation for Crack-Resistant Die Interconnects
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Solution Overview
Problem
Conventional semiconductor fabrication faces challenges such as cracking and delamination when multiple IC dies are interconnected, leading to lower yield and degraded device performance.
Innovation Solution
The use of a bridge die with a different surface orientation than the IC dies, which is mechanically coupled to reduce structural defects by mismatching the crystal lattice orientations, thereby enhancing mechanical integrity and stress tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple IC dies are interconnected using conventional fabrication methods, then device functionality is achieved, but structural defects such as cracking and delamination occur
Solution Approach 1:
The patent introduces a bridge die as an intermediary component between two IC dies. This bridge die has a different crystal orientation (e.g., <110> or <100>) compared to the IC dies (e.g., <001>), serving as a mediator that reduces stress transfer and prevents cracking and delamination while maintaining electrical interconnection functionality
Solution Approach 2:
The patent changes the crystal orientation parameter of the bridge die substrate to be different from the IC dies. This parameter change in crystal structure creates mismatched lattice orientations that reduce stress concentration and prevent structural defects during interconnection
2Manufacturing precision
If IC dies with matching crystal lattice orientations are interconnected, then alignment precision is improved, but stress concentration increases leading to structural defects
Solution Approach 1:
The patent applies asymmetry by using a bridge die with different crystal orientation than the IC dies. While this creates asymmetric alignment requirements, it symmetrically distributes stress through the orientation mismatch, preventing stress concentration and structural defects that would occur with matching orientations
3Strength
If a bridge die with different surface orientation is used to interconnect IC dies, then mechanical integrity is enhanced, but device complexity increases
Solution Approach 1:
The bridge die serves multiple functions simultaneously: it provides mechanical support, enables electrical interconnection, and acts as a stress-relief element through its different crystal orientation. This multi-functionality reduces the need for additional separate components, thereby managing complexity while enhancing mechanical integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces defects like cracking and delamination, improves device yield, and enhances performance by providing enhanced mechanical strength and stress tolerance.
Implementation Method 1
The third die includes a third substrate having a second surface orientation. The second surface orientation is different from the first surface orientation
Data Source
AI summary
A first integrated circuit (IC) die includes a first substrate. A second IC die includes a second substrate. At least one of the first substrate or the second substrate has a first surface orientation. The first IC die is spaced apart from the second IC die. A third die electrically interconnects the first IC die to the second IC die. The third die includes a third substrate having a second surface orientation. The second surface orientation is different from the first surface orientation.