Bridge Die Transfer for Direct Semiconductor Mounting
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Solution Overview
Problem
Conventional semiconductor device fabrication processes result in packaged devices that are significantly larger and more costly than necessary, limiting the thickness and efficiency of circuit assemblies due to the packaging of semiconductor die.
Innovation Solution
A machine and method for directly transferring unpackaged semiconductor die from a substrate to a product substrate, reducing the need for packaging by using bridges and transfer mechanisms to align and affix the die with precision, allowing for thinner and more efficient product substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging is used for semiconductor die, then the die are protected from environmental degradation, but the packaged devices become significantly larger and thicker
Solution Approach 1:
The patent extracts the protective packaging from the semiconductor die, transferring the die directly onto the circuit board without enclosing them in traditional packages. This eliminates the volume increase while maintaining functionality through direct mounting of unpackaged die.
2Reliability
If conventional packaging is used for semiconductor die, then the die are protected during handling and installation, but the manufacturing cost increases
Solution Approach 1:
The patent removes the packaging step entirely from the manufacturing process, allowing die to be handled and mounted in their unpackaged state. This eliminates packaging material costs and reduces manufacturing complexity while maintaining handling capability through precise pick-and-place mechanisms.
3Ease of operation
If packaging is used for semiconductor die, then the die can be easily handled and installed, but the circuit assembly becomes thicker
Solution Approach 1:
The patent extracts the die from their packaged state and mounts them directly onto the circuit board. This eliminates the packaging thickness while the pick-and-place system provides automated handling and installation capability for the unpackaged die.
4Reliability
If conventional packaging processes are followed, then the die are protected from damage, but the manufacturing time increases
Solution Approach 1:
The patent removes the packaging process from the manufacturing sequence, allowing die to be transferred and mounted directly without prior packaging. This eliminates the time required for packaging operations while damage protection is maintained through careful handling in the pick-and-place system.
Data Source
AI summary
An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.