Bridge Die Package Structure for Reliable Wafer-Level Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ensuring the reliability of wafer level packaging in semiconductor devices and integrated circuits is a challenge, particularly in the manufacturing of electronic apparatus such as cell phones and other mobile electronic equipment.
Innovation Solution
A manufacturing process involving a carrier with a de-bonding layer, redistribution structures with conductive pillars and bridge structures, encapsulation, and planarization to form a package that integrates dies and passive components, allowing for high-density interconnections without additional substrates, thereby reducing package size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafer level packaging is used to reduce package size, then package dimensions are reduced, but reliability of connections deteriorates
Solution Approach 1:
The package is segmented into distinct functional layers: semiconductor dies, redistribution structures with conductive pillars, bridge structures, and encapsulant. This segmentation allows each component to be optimized independently while maintaining overall connection reliability despite the compact wafer-level form factor.
Solution Approach 2:
The patent transitions from planar 2D packaging to 3D vertical stacking with multiple redistribution structures and bridge structures connecting dies in different layers. This dimensional change enables high-density interconnections while maintaining connection reliability through vertical pathways rather than horizontal routing.
2Reliability
If additional substrates are used to ensure connection reliability, then connection reliability is improved, but package size and cost increase
Solution Approach 1:
The patent merges the substrate function directly into the semiconductor die structure itself. The redistribution structures and conductive pillars are integrated within the package body rather than using separate substrate boards, eliminating the need for additional substrates while maintaining connection reliability through the encapsulated 3D interconnection architecture.
Solution Approach 2:
The encapsulant serves multiple functions simultaneously: it provides mechanical support, protects conductive elements, fills voids, and enables thermal management. This multi-functionality replaces what would traditionally require separate substrate and protective components, reducing overall package size while ensuring connection reliability.
3Reliability
If more materials are used to ensure secure connections, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent uses thin film encapsulant material to securely enclose and protect all conductive elements and interconnections. This thin film approach provides adequate mechanical protection and environmental sealing with minimal material consumption, ensuring connection reliability without excessive material usage that would increase manufacturing cost.
Data Source
AI summary
A package includes a redistribution structure, a bridge die, conductive pillars, connectors, a first die, first solder joints, and second solder joints. The bridge die includes a substrate, a dielectric layer disposed on the substrate, and routing patterns embedded in the dielectric layer. The conductive pillars are coupled to the redistribution structure at a position that is laterally offset from the bridge die. The connectors are coupled to the bridge die and the redistribution structure, such that the bridge die is electrically coupled to the redistribution structure through at least the connectors. The first solder joints are coupled to the redistribution structure and the first die, such that the first die is electrically coupled to the bridge die. The second solder joints are coupled to the redistribution structure and the first die, such that the first die is electrically coupled to the conductive pillars.