Bridge Structure Holding Fiber Access Unit in Co-Packaged Optics

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Solution Overview

Problem

Current methods for coupling light to SiP PICs in co-packaged optics face challenges such as high losses due to mode field diameter differences between fibers and silicon waveguides, limited bandwidth of grating couplers, and geometric limitations in fiber orientation.

Innovation Solution

A mechanism involving a bridge structure with springs and lifters is introduced to securely hold FAUs in receptacles across multiple SiP chips, allowing for individual insertion and extraction of FAUs, and providing mechanical features to align and press FAUs into position.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If FAUs are directly glued to SiP chips or held by hinging covers, then the assembly is simple, but the FAUs cannot be individually inserted and extracted

Engineering Contradiction:

ImproveIndividual insertion and extraction of FAUsVSAvoidHolding mechanism structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The holding mechanism is segmented into modular components: a bridge structure spanning multiple SiP chips, individual receptacles for each FAU, and independent springs for each FAU. This segmentation allows individual FAUs to be inserted and extracted independently while maintaining a relatively simple overall structure.

Inventive Principle:

Principle #1Segmentation

2Ease of operation

If a holding mechanism spans across multiple SiP chips, then individual FAU insertion and extraction is enabled, but the manufacturing precision requirements increase

Engineering Contradiction:

ImproveIndividual FAU insertion and extractionVSAvoidAlignment across multiple chips

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

Multiple SiP chips are merged under a single bridge structure that provides unified mechanical support and alignment. The bridge structure combines the function of holding multiple chips and providing alignment references, reducing the need for high precision machining on each individual chip while enabling individual FAU operations.

Inventive Principle:

Principle #5Merging (Combining)

3Loss of energy

If mode converters are added to couple fibers to SiP waveguides, then coupling losses are reduced, but the device complexity increases

Engineering Contradiction:

ImproveLight coupling lossVSAvoidOptical system components

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

Mode converters serve as intermediary components between the fiber array unit and the SiP waveguides. These converters mediate the coupling by transforming the mode field diameter from fiber scale to waveguide scale, reducing coupling losses while keeping the overall system architecture relatively simple through a dedicated conversion layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the ease of manufacturing, allows for separate insertion and removal of FAUs, and provides a robust mechanical solution with minimal need for high precision machining, thereby improving the efficiency of light coupling in co-packaged optics.

Implementation Method 1

a bridge structure having at least one spring configured to exert a force on the FAU

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20250138255A1Mechanisms and assemblies for holding a fiber access unit in a receptacle for co-packaged optics

Publication Date: 2025.05.01 CORNING RES & DEV CORP

AI summary

A mechanism for co-packaged optics includes a FAU and a bridge structure having at least one spring configured to exert a force on the FAU. In preferred configurations, the bridge structure includes at least one lifter that facilitates disengagement of the at least one spring. Holding mechanisms and assemblies for holding an FAU in a receptacle are also disclosed.