Bridge FPC Touch Routing for Low-Interference Display Assembly
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Solution Overview
Problem
Existing flexible circuit board (FPC) connections in display apparatuses with a flexible multi-layer on cell (FMLOC) structure are inefficient, requiring large connectors that increase labor and material costs, and suffer from signal interference due to manual assembly and complex wiring.
Innovation Solution
The implementation of a main FPC and bridge FPC connection system with soldered joints and integrated shielding lines to reduce interference and streamline manufacturing, utilizing flexible substrates like polyethylene terephthalate and polyimide for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple electrode structure is used, then device complexity is reduced, but aperture ratio and display quality deteriorate
Solution Approach 1:
The electrode structure is segmented into a first electrode and a second electrode that are disposed in an interdigitated manner, allowing each electrode to be simpler in design while collectively achieving the desired aperture ratio through their combined arrangement
Solution Approach 2:
The electrodes are arranged in a two-dimensional interdigitated pattern rather than a simple linear or planar configuration, enabling increased aperture ratio by utilizing spatial distribution in multiple dimensions while keeping individual electrode structures simple
2Device complexity
If a simple electrode structure is used, then device complexity is reduced, but manufacturing precision requirements worsen
Solution Approach 1:
Alignment marks are formed in advance on the substrate before electrode deposition, providing pre-established reference points that guide subsequent electrode formation processes and ensure precise alignment without requiring complex real-time adjustment mechanisms
Solution Approach 2:
Alignment marks serve as an intermediary element that mediates between the substrate and the electrode structures, enabling precise positioning of electrodes relative to each other and to the substrate features through a standardized reference system
3Ease of manufacture
If organic EL materials are used, then device fabrication is simplified, but heat resistance and lifespan deteriorate
Solution Approach 1:
The operating voltage of the display device is optimized to a specific range (10V to 20V) that allows organic EL materials to operate efficiently without excessive heat generation, thereby extending lifespan while maintaining the fabrication simplicity of organic materials
Solution Approach 2:
The patent converts the heat generation issue of organic EL materials into a manageable parameter by designing the interdigitated electrode structure to distribute current more evenly, reducing hot spots and converting the potential harm of heat into a benefit of more uniform operation and extended lifespan
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency, reduces costs, and minimizes signal interference by optimizing the FPC structure, improving the overall performance and production efficiency of display apparatuses.
Implementation Method 1
an organic electroluminescence layer, which emits light
Data Source
Figure 1~2
Figure 3A~3B
Figure 3C~3D
AI summary
A display device, comprising a display panel, a touch layer, and flexible circuit boards. The flexible circuit boards comprise a main flexible circuit board and a bridge flexible circuit board. A third soldering area of the bridge flexible circuit board is soldered to a first soldering area of the main flexible circuit board, and a fourth soldering area of the bridge flexible circuit board is soldered to a second soldering area of the main flexible circuit board. Each first touch connection line of the main flexible circuit board has one end electrically connected to a touch chip, and the other end electrically connected to a first touch lead in the touch layer; each second touch connection line of the main flexible circuit board has one end electrically connected to a pad in the second soldering area, and the other end electrically connected to a second touch lead in the touch layer; each third touch connection line of the main flexible circuit board has one end electrically connected to a pad in the first soldering area, and the other end electrically connected to the touch chip. Each touch transit line of the bridge flexible circuit board has one end electrically connected to a pad in the third soldering area, and the other end electrically connected to a pad in the fourth soldering area.