Bridge Interconnect Air Gap Dielectric for Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chip-to-chip interconnect solutions in integrated circuit package assemblies face issues due to high electrical resistivity of interconnection substrates and high dielectric constants of adjacent dielectric materials, affecting electrical performance.
Innovation Solution
A bridge interconnect assembly is embedded in a package assembly, featuring a bridge substrate with air gaps acting as dielectric material between electrical routing features, composed of high resistivity materials like glass or semiconductor materials, and through-hole vias for electrical pathways, reducing capacitance and enhancing electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional dielectric materials are used adjacent to electrically conductive features, then structural support and insulation are provided, but electrical resistivity is too low and dielectric constant is too high, adversely affecting electrical performance
Solution Approach 1:
The dielectric region is segmented into multiple air gaps positioned at strategic locations adjacent to electrically conductive features, rather than using a continuous traditional dielectric material. This segmentation reduces the overall dielectric constant and electrical resistivity while maintaining necessary insulation and support functions.
Solution Approach 2:
Air gaps are introduced as porous regions within the dielectric structure, replacing solid dielectric material with air-filled spaces. This creates an effective dielectric material with lower dielectric constant and improved electrical resistivity, directly addressing the harmful factors while maintaining structural integrity through the bridge substrate design.
2Reliability
If air gaps are introduced as dielectric material, then capacitance is reduced and electrical performance is enhanced, but manufacturing complexity increases
Solution Approach 1:
The bridge substrate is pre-formed with integrated air gaps and electrical routing features before being positioned in the package assembly. This preliminary formation of the complex air gap structure simplifies the overall manufacturing process by eliminating the need for post-assembly dielectric modification or complex in-situ air gap creation processes.
Solution Approach 2:
The bridge substrate serves as an intermediary component that pre-integrates the air gap dielectric structure and electrical routing features. This intermediary element simplifies the final assembly process, as the air gaps are already formed and positioned correctly within the bridge substrate before it is installed in the package assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves electrical performance by reducing capacitance and enhancing signal routing efficiency between chips, thereby addressing the limitations of existing interconnect solutions.
Implementation Method 1
featuring a bridge substrate with air gaps acting as dielectric material between electrical routing features
Data Source
AI summary
Embodiments of the present disclosure are directed towards techniques and configurations for a bridge interconnect assembly that can be embedded in a package assembly. In one embodiment, a package assembly includes a package substrate configured to route electrical signals between a first die and a second die and a bridge embedded in the package substrate and configured to route the electrical signals between the first die and the second die, the bridge including a bridge substrate, one or more through-hole vias (THVs) formed through the bridge substrate, and one or more traces disposed on a surface of the bridge substrate to route the electrical signals between the first die and the second die. Routing features including traces and a ground plane of the bridge interconnect assembly may be separated by an air gap. Other embodiments may be described and/or claimed.