Bridge Interconnect Packaging for Low-Loss Multi-Die Communication
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Solution Overview
Problem
Improving electrical communication between multiple integrated circuits in electronic devices by reducing signal loss and interference, while simplifying manufacturing processes and reducing costs.
Innovation Solution
Incorporating a bridge interconnect directly coupled to the dies with interconnecting materials, such as solder, to facilitate electrical communication between dies, and using a molding material for mechanical support, which reduces the need for substrate cavities and minimizes signal loss and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate cavities are used to accommodate dies for electrical communication, then mechanical support is provided, but signal loss and interference increase
Solution Approach 1:
The patent extracts the die accommodation function from the substrate by introducing a separate carrier substrate. The carrier substrate provides mechanical support and holds multiple dies, while the substrate focuses on routing traces and electrical communication. This separation eliminates the need for substrate cavities, reducing signal loss and interference while simplifying manufacturing.
Solution Approach 2:
The carrier substrate acts as an intermediary between the dies and the substrate. It provides mechanical support for the dies and facilitates their electrical connection to the substrate through routing traces, eliminating the need for complex substrate cavity structures and reducing signal interference.
2Reliability
If multiple routing traces are implemented in substrate for electrical communication between integrated circuits, then electrical connectivity is achieved, but signal loss and interference increase
Solution Approach 1:
The patent extracts the electrical connection function from the substrate by implementing it on the carrier substrate instead. The routing traces are moved to the carrier substrate where they connect the dies, separating this function from the substrate and reducing signal loss and interference in the substrate's routing traces.
3Strength
If substrate cavities are used to accommodate dies, then mechanical support is provided, but manufacturing complexity and costs increase
Solution Approach 1:
The patent extracts the mechanical support function from the substrate by introducing a dedicated carrier substrate. The carrier substrate is specifically designed to hold multiple dies and provide mechanical support, while the substrate focuses on electrical routing. This separation eliminates complex substrate cavity structures and simplifies manufacturing.
Solution Approach 2:
The carrier substrate serves multiple functions: it provides mechanical support for multiple dies, facilitates electrical connections between dies and substrate, and simplifies the overall manufacturing process. This multi-functionality reduces the need for complex substrate designs and lowers manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bridge interconnect reduces signal loss and interference, simplifies manufacturing, and lowers costs by improving manufacturing yields and process complexity.
Implementation Method 1
Incorporating a bridge interconnect directly coupled to the dies with interconnecting materials, such as solder
Data Source
AI summary
An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.