Bridge Interconnect Multi-Chip Packaging for Shorter Signal Paths
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Solution Overview
Problem
Existing electronic devices face challenges in reducing signal loss and interference between integrated circuits, which complicates manufacturing and increases costs.
Innovation Solution
The implementation of a bridge interconnect with directly coupled die contacts using materials like solder, reducing the need for substrate cavities and minimizing signal travel length, thereby enhancing electrical communication and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional substrate-based electrical communication is used between integrated circuits, then routing traces in substrate can facilitate communication, but signal loss and interference increase with longer signal travel paths
Solution Approach 1:
The patent transitions from planar routing traces on a substrate to three-dimensional vertical stacking of dies with direct inter-die coupling. This dimensional change allows electrical communication to occur through vertical pathways via bridge interconnects rather than horizontal substrate traces, significantly reducing signal travel length and associated losses while maintaining communication functionality.
Solution Approach 2:
The patent introduces bridge interconnects as intermediary structures that directly couple die contacts between adjacent dies. These bridge interconnects serve as mediators that establish direct electrical pathways, eliminating the need for long substrate routing traces and reducing signal loss while enabling efficient inter-die communication.
2Reliability
If substrate cavities are used to accommodate dies for direct coupling, then electrical communication efficiency improves, but manufacturing complexity and costs increase
Solution Approach 1:
The patent segments the electronic device into multiple independent dies that are stacked vertically rather than planarly integrated on a substrate. Each die can be manufactured separately using standard semiconductor fabrication processes, and then assembled through direct coupling with bridge interconnects. This segmentation simplifies manufacturing by allowing specialized fabrication for each die type while achieving efficient electrical communication.
Solution Approach 2:
The patent extracts the dies from the traditional substrate-based architecture and positions them in a vertical stack with direct inter-die coupling. By removing the substrate cavity requirement and using direct bonding with bridge interconnects, the design achieves efficient electrical communication while simplifying the manufacturing process through standard die stacking techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces signal loss and interference, simplifies the manufacturing process, and lowers costs by facilitating direct electrical communication between dies, improving the performance and yield of electronic devices.
Implementation Method 1
The first die contacts may be directly coupled to the first set of bridge contacts (e.g., with an interconnecting material, such as solder)
Data Source
AI summary
An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.