Bridge-Connected Interposer Assembly for Large Package Integration

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Solution Overview

Problem

The challenge of joining large-sized interposers on substrates is affecting yield and wafer utilization, particularly in multi-function and application scenarios.

Innovation Solution

A semiconductor package design involving a first and second interposer connected by a bridge die, allowing for easy formation and jointing of a large-sized interposer on a substrate, enhancing wafer yield and utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If large-sized interposers are joined on substrates, then multi-function and application capabilities are improved, but yield and wafer utilization deteriorate

Engineering Contradiction:

Improvemulti-function capabilityVSAvoidwafer utilization

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The large-sized interposer is divided into multiple smaller interposers that can be processed and joined separately on the substrate. This segmentation allows each smaller interposer to be handled within standard wafer processing capabilities, maintaining high yield and wafer utilization while still achieving the overall multi-functional capability when the interposers are assembled together.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If large-sized interposers are joined on substrates, then multi-function and application capabilities are improved, but manufacturing difficulty increases

Engineering Contradiction:

Improvemulti-function capabilityVSAvoidjoining difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Dividing the large interposer into smaller segments makes the joining process more manageable and compatible with existing manufacturing equipment and processes, reducing the overall manufacturing difficulty while achieving multi-functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The smaller interposers can be prepared, tested, and pre-assembled separately before final integration on the substrate. This preliminary action allows for quality control and process optimization at each stage, reducing the complexity of the final joining operation.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20250372491A1Semiconductor package and method of forming the same

Publication Date: 2025.12.04 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package and a method of forming the same are provided. The semiconductor package includes a substrate, a first interposer, a second interposer, a first die, a second die and a bridge die. The first interposer and the second interposer are arranged side by side over the substrate. The first die is disposed on the first interposer. The second die is disposed on the second interposer. The bridge die is disposed on and electrically connected between the first interposer and the second interposer. The first die and the second die are electrically connected to each other through the first interposer, the second interposer and the bridge die.