Bridge Interposer Side-by-Side Die Package Height Reduction
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Solution Overview
Problem
Conventional split die semiconductor packages face challenges with fine line and space parameters, requiring precise alignment and being costly, and conventional interposers increase package height, making them unsuitable for high-volume manufacturing.
Innovation Solution
A bridge interposer with fine line and space parameters is positioned within a substrate cavity, and a thermal element is embedded in the second substrate to reduce package height and enhance heat dissipation, while a self-aligning solder reflow process connects the dies to the bridge interposer, addressing alignment and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon interposer is used to connect split dies, then Die-to-Die interconnects can be achieved, but the package height increases which is undesirable
Solution Approach 1:
The patent transitions from vertical stacking (3D packaging) to horizontal side-by-side arrangement (2D packaging) of dies. This dimensional change eliminates the need for a thick silicon interposer, achieving Die-to-DDie interconnects while maintaining a lower package profile through lateral placement rather than vertical stacking.
Solution Approach 2:
The patent uses an organic interposer that copies the interconnection functionality of traditional silicon interposers but with reduced height. The organic substrate replicates the routing and interconnect capabilities needed for Die-to-Die connections while being inherently thinner, thus resolving the height issue.
2Manufacturing precision
If fine line and space parameters (L/S) are used for interconnects, then precise Die-to-Die alignment is achieved, but manufacturing cost increases and placement precision requirements become more stringent
Solution Approach 1:
The organic interposer incorporates self-aligning features such as alignment marks, notches, or geometric cues that guide die placement automatically. This self-service alignment mechanism reduces the need for expensive external alignment equipment and minimizes placement precision requirements, thereby lowering manufacturing costs while maintaining accurate Die-to-Die interconnects.
Solution Approach 2:
The organic interposer acts as an intermediary layer with built-in alignment structures that mediate between the dies and the placement equipment. These intermediary alignment features simplify the alignment process by providing mechanical or visual references, reducing the stringency of placement precision requirements and easing manufacturing complexity.
3Adaptability or versatility
If multiple redistribution layers (RDLs) are embedded in the substrate, then complex interconnect routing is achieved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
Instead of implementing multiple complex RDL layers throughout the entire substrate, the organic interposer uses localized routing regions or simplified trace patterns only where needed for specific Die-to-Die connections. This local quality approach provides sufficient interconnect routing capability for the application while avoiding the manufacturing complexity of full multi-layer RDL structures.
Solution Approach 2:
The interconnect routing is segmented into discrete, simplified pathways on the organic interposer rather than continuous complex multi-layer RDLs. This segmentation breaks down the routing function into manageable sections that are easier to manufacture, reducing overall device complexity while maintaining the necessary adaptability for Die-to-Die interconnections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces package height, improves heat dissipation, and simplifies the manufacturing process by aligning and connecting dies efficiently, making it more suitable for high-volume production.
Implementation Method 1
a self-aligning solder reflow process connects the dies to the bridge interposer
Implementation Method 2
a thermal element attached to the backsides of the dies in the package
Data Source
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AI summary
A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.