Bridge Module Die-to-Die Interconnection
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Solution Overview
Problem
The high cost and complexity of 2.5D SiP packages due to the need for a separate interposer, which increases manufacturing costs and requires complex die embedding steps, are not effectively addressed by existing technologies.
Innovation Solution
A semiconductor assembly with a pre-fabricated bridge module that electrically connects IC die to a package substrate without an interposer, using epoxy or molding compound for mechanical and electrical coupling, and is separate from the package substrate to avoid thermal expansion mismatches, allowing for a pre-fabricated semiconductor assembly that can be mounted to a PCB or package substrate without sequential build-up requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate interposer is used to connect multiple IC die in a 2.5D SiP package, then electrical connections between IC die and package substrate are achieved, but manufacturing cost and device complexity significantly increase
Solution Approach 1:
The patent extracts the interposer function from the traditional 2.5D SiP architecture by implementing die-to-die interconnection directly through back-to-back flip-chip bonding. The interposer is completely eliminated, removing the source of thermal expansion mismatch and manufacturing complexity while maintaining all necessary electrical connection functions through direct die coupling
Solution Approach 2:
The patent merges the functions of the interposer and package substrate by directly bonding IC die to the package substrate through flip-chip technology. The interposer's electrical interconnection function is consolidated into the direct die-to-substrate bonding interface, simplifying the overall package architecture to essential components only
2Adaptability or versatility
If a separate interposer is used with through-silicon vias to connect metallization layers, then signal routing between IC die is enabled, but manufacturing cost increases due to separate design, manufacture, and test requirements
Solution Approach 1:
The patent applies preliminary action by pre-fabricating the IC die with integrated interconnect structures and bond pads that enable direct back-to-back bonding. The signal routing capability is built into the die design itself before assembly, eliminating the need for separate interposer fabrication, via formation, and metallization deposition steps
Solution Approach 2:
The patent replaces the expensive, complex interposer with a simpler, more economical direct bonding approach. The interposer's function is achieved through standard flip-chip bonding processes that are already established in the industry, avoiding the need for specialized interposer manufacturing facilities and reducing overall system cost
3Stability of the object's composition
If an interposer is embedded in the package substrate, then die embedding is achieved, but the assembly process becomes complex and costly
Solution Approach 1:
The patent inverts the traditional embedding approach by eliminating the need to embed an interposer within the package substrate. Instead, IC die are directly bonded to the package substrate in a back-to-back configuration, reversing the conventional sequence and eliminating the embedding step entirely. This simplifies the assembly process while achieving stable die attachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and complexity by eliminating the need for an interposer and simplifying the assembly process, while ensuring reliable electrical connections between IC die and the package substrate, and allowing for independent construction of the bridge module without matching thermal expansion coefficients.
Implementation Method 1
an epoxy bonding the first IC die to the second IC die, and the bridge module to each of the first IC die and the second IC die
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3B
AI summary
In one example, a semiconductor assembly comprises a first IC die (104A), a second IC die (104B), and a bridge module (110). The first IC die includes, on a top side thereof, first interconnects (108A) of a plurality of interconnects (108) and first inter-die contacts (608A) of a plurality of inter-die contacts (608). The second IC die includes, on a top side thereof, second interconnects (108B) of the plurality of interconnects and second inter-die contacts (608B) of the plurality of inter-die contracts. The bridge module is disposed between the first interconnects and the second interconnects and includes bridge interconnects (112) on a top side thereof, the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts, and layer(s) of conductive interconnect (706) disposed on the top side thereof to route signals between the first IC and the second IC. A back side (710) of the bridge module does not extend beyond a height of the plurality of interconnects.