Bridge Semiconductor Package Layout for Heat Dissipation and Stability

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Solution Overview

Problem

Current semiconductor packages face challenges in achieving high integration, high speed, and efficient heat dissipation while maintaining structural stability, particularly as electronic devices become smaller and more complex, and existing manufacturing methods are costly.

Innovation Solution

A semiconductor package is designed with a bridge structure that connects multiple semiconductor chips, incorporating dummy structures and insulating layers for thermal dispersion and structural support, and a method that involves bonding, gap-fill insulation, and connection formation to reduce manufacturing costs and enhance thermal stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple semiconductor chips are stacked and arranged to achieve high integration, then device functionality and capacity are improved, but heat dissipation becomes more difficult and structural stability deteriorates

Engineering Contradiction:

Improvehigh integrationVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent segments the semiconductor package into multiple functional layers: carrier structure for heat dissipation, bridge structure for mechanical support, semiconductor chips for functionality, and insulating layers for thermal management. This segmentation allows each component to address specific requirements including heat dissipation pathways and structural stability while maintaining high integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediary components including the bridge structure that mediates between semiconductor chips, dummy structures as thermal intermediaries, and insulating layers that act as thermal barriers. These intermediaries facilitate heat transfer from chips to the carrier structure while maintaining structural integrity and electrical isolation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If multiple semiconductor chips are stacked and arranged to achieve high integration, then device functionality and capacity are improved, but structural stability deteriorates

Engineering Contradiction:

Improvehigh integrationVSAvoidstructural stability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The bridge structure serves multiple functions simultaneously: it provides mechanical support for stacking chips, acts as a thermal conduction pathway, offers structural anchoring points, and maintains spatial arrangement. This multi-functionality ensures structural stability while enabling high integration without requiring separate dedicated components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The carrier structure is prepared in advance with predetermined bonding positions and heat dissipation pathways before chip mounting. The bridge structure and dummy structures are pre-positioned to establish structural framework and thermal pathways, ensuring stability is built into the architecture from the outset rather than added as a corrective measure.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If complex manufacturing methods are used to achieve high integration and heat dissipation, then device performance is improved, but manufacturing cost increases

Engineering Contradiction:

Improvehigh integrationVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges multiple functions into integrated structures: the bridge structure combines mechanical support and thermal conduction, the carrier structure integrates heat dissipation with chip mounting substrate, and dummy structures serve both as placeholders for alignment and as thermal pathways. This merging reduces the number of separate manufacturing steps and components, lowering overall manufacturing cost while achieving high integration.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively connects multiple semiconductor chips through a bridge structure, ensuring both structural stability and efficient heat dissipation, while reducing manufacturing costs by utilizing a single carrier structure as a heat dissipation substrate.

Implementation Method 1

bonding a first semiconductor chip and a bridge structure onto a carrier structure

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

forming a heat dissipation structure by processing the carrier structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240429222A1Semiconductor package and method of manufacturing the same

Publication Date: 2024.12.26 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of manufacturing a semiconductor package includes bonding a first semiconductor chip and a bridge structure onto a carrier structure; bonding a second semiconductor chip and a third semiconductor chip onto the bridge structure, the second semiconductor chip and the third semiconductor chip being apart from each other in a horizontal direction; and forming a plurality of connection bumps on the second semiconductor chip and the third semiconductor chip.