Bridge Package Structure for High-Density Multi-Die Interconnects
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and compact packaging of electronic components due to limitations in feature size reduction and packaging efficiency, particularly in the manufacturing of integrated fan-out packages.
Innovation Solution
The method involves attaching multiple dies side by side on a carrier using an adhesive layer, forming conductive vias and a bridge structure for flip-chip bonding, and encapsulating with a molding compound to create a compact package structure with through vias and redistribution layers for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple dies are attached side by side on a carrier with complex interconnecting structures, then electrical connectivity between dies is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple separate interconnecting structures (conductive vias, bonding pads, and wire bonds) into a single integrated bridge structure. This bridge structure directly connects the active regions of multiple semiconductor dies, eliminating the need for separate conductive pathways and reducing overall device complexity while maintaining electrical connectivity.
Solution Approach 2:
The bridge structure acts as an intermediary element between multiple semiconductor dies. It provides a simplified mediation mechanism for electrical connection, replacing complex multi-component interconnect systems with a single mediating structure that facilitates signal and power transmission between dies.
2Reliability
If traditional packaging methods with multiple processing steps are used, then package reliability is maintained, but manufacturing productivity and yield decrease
Solution Approach 1:
The bridge structure is pre-formed on the carrier substrate before the semiconductor dies are mounted. This preliminary action allows subsequent die attachment and encapsulation steps to proceed more efficiently, reducing the total number of processing steps required and improving manufacturing yield while maintaining package reliability.
Solution Approach 2:
The manufacturing process is segmented into distinct modular steps: bridge structure formation, die attachment, and encapsulation. This segmentation allows each step to be optimized independently and enables parallel processing, thereby increasing productivity and yield while ensuring quality control for package reliability.
3Quantity of substance
If feature size is continuously reduced to increase integration density, then more components can be integrated, but manufacturing precision requirements and costs increase
Solution Approach 1:
The bridge structure extends in the vertical dimension (z-axis) to provide interconnections, allowing horizontal feature sizes to remain larger and easier to manufacture. By utilizing the third dimension for routing, the patent achieves high integration density without requiring proportionally smaller lateral features, thus reducing manufacturing precision requirements.
Data Source
AI summary
Provided are a package and a method of manufacturing the same. The package includes a first die, a second die, a bridge structure, an encapsulant, and a redistribution layer (RDL) structure. The first die and the second die are disposed side by side. The bridge structure is disposed over the first die and the second die to electrically connect the first die and the second die. The encapsulant laterally encapsulates the first die, the second die, and the bridge structure. The RDL structure is disposed over a backside of the bridge structure and the encapsulant. The RDL structure includes an insulating structure and a conductive pattern, the conductive pattern is disposed over the insulating structure and extending through the insulating structure and a substrate of the bridge structure, so as to form at least one through via in the substrate of the bridge structure.