Bridge Package Layout With Off-Bridge Photonic and Electrical Interposers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for artificial intelligence computing, particularly in machine learning and deep learning, requires connecting multiple chips with low latency and high-speed data transfer, which current technologies struggle to meet due to the high cost and complexity of photonic interposers.
Innovation Solution
The use of a circuit package design that incorporates a photonic interposer and a second, less expensive non-photonic interposer, allowing dies to connect to both, reducing overall costs by using two smaller interposers instead of a single large one, and enabling efficient data transmission through both photonic and electrical means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a single large photonic interposer is used to connect multiple chips for high-speed data transfer, then data transmission speed is improved, but cost and device complexity increase significantly
Solution Approach 1:
The patent divides the interposer system into two separate components: a photonic interposer for optical signal transmission and an electrical interposer for electrical signal transmission. This segmentation allows each interposer to be optimized for its specific function and reduces the overall complexity compared to a single integrated photonic interposer that would handle all connections.
Solution Approach 2:
The die is designed to interface with both photonic and electrical interposers, enabling it to handle both optical and electrical signal transmissions. This multi-functionality allows the system to achieve high-speed data transfer through the photonic path while using electrical connections for other communications, thereby improving overall system performance without requiring a single complex photonic interposer for all functions.
2Speed
If a photonic interposer is used to achieve low latency and high-speed data transfer, then data transmission performance is improved, but manufacturing cost increases
Solution Approach 1:
By segmenting the interposer system into photonic and electrical components, the patent reduces the manufacturing cost. The electrical interposer can be manufactured using standard semiconductor fabrication processes, while the photonic interposer only needs to handle specific high-speed channels. This division allows cost-effective manufacturing compared to building a single large photonic interposer that would require expensive photonic integration across the entire device.
Solution Approach 2:
The electrical interposer provides a cost-effective solution for connections that do not require high-speed optical transmission. By using cheaper electrical interposer materials and manufacturing processes for non-critical paths, the overall system cost is reduced while maintaining high-performance optical channels where needed.
3Productivity
If multiple chips are connected with photonic interposers to meet AI computing demands, then processing capacity is improved, but system complexity and cost increase
Solution Approach 1:
The patent applies segmentation to the interconnection system by separating photonic and electrical interposers. This allows multiple chips to be connected with optimized pathways: high-bandwidth applications use photonic channels while lower-bandwidth communications use electrical channels. The segmentation reduces system complexity by allowing independent optimization and manufacturing of each interposer type.
Solution Approach 2:
Different interconnection qualities are applied to different parts of the system based on performance requirements. Critical high-speed data paths between AI processing units use photonic interposers with low latency, while other connections use electrical interposers. This local quality approach optimizes processing capacity where needed while reducing overall system complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the cost of circuit packages while maintaining high-speed data transfer capabilities, addressing the latency and complexity challenges in AI computing by optimizing interposer usage and transmission methods.
Implementation Method 1
a photonic interposer... enable a first processing element to transmit data using the photonic interposer
Implementation Method 2
an electrical interposer... enable a second processing element to transmit data using the electrical interposer
Data Source
AI summary
A circuit package is described that includes a photonic interposer, a second interposer, and a die partially overlapping and connected to both the photonic interposer and the second interposer.