Bridge-Based Electronic Package Assembly to Prevent Conductor Voids
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues with void formation in conductors during thermal curing, leading to bonding problems between conductors and circuit structures, which affects the reliability of multi-layer circuits.
Innovation Solution
The electronic package and manufacturing method involve fabricating an electronic module with an encapsulation layer containing a bridge component and conductive pillars, and a packaging module with a circuit structure, where the modules are stacked via supporting elements to prevent excessive thermal processing, thereby minimizing void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple dielectric layers are thermally cured to form multi-layer circuit structure, then circuit functionality is improved, but voids form in conductors causing bonding issues
Solution Approach 1:
The patent segments the manufacturing process into two independent modules: an electronic module containing the bridge component and conductive pillars, and a packaging module containing the multi-layer circuit structure. This segmentation allows the circuit structure to be thermally cured without exposing the bridge component to repeated thermal processes, thus preventing void formation while maintaining multi-layer circuit functionality.
Solution Approach 2:
The bridge component and conductive pillars are pre-assembled and encapsulated in the electronic module before the multi-layer circuit structure is formed. This preliminary action protects the bridge component from subsequent thermal curing processes of the circuit structure, preventing void formation in the conductors while still enabling the circuit to achieve its full functionality.
2Reliability
If bridge component is embedded in encapsulation layer with conductors, then electrical bridging is achieved, but conductors generate voids during thermal process
Solution Approach 1:
The patent separates the bridge component assembly from the circuit structure assembly into distinct modules. The electronic module contains the bridge component with conductors already in place, while the packaging module contains the multi-layer circuit structure. This segmentation allows independent processing of each module, protecting the conductor integrity in the electronic module while still achieving electrical bridging functionality.
Solution Approach 2:
The encapsulation layer acts as an intermediary that protects the bridge component and its conductors from the thermal processes used to form the multi-layer circuit structure. By embedding the bridge component in the encapsulation layer before circuit formation, the encapsulation layer shields the conductors from thermal exposure that would cause void formation, while still allowing electrical connections to be established.
3Adaptability or versatility
If conventional FO-EB process is used, then packaging functionality is achieved, but repeated thermal processes cause void formation
Solution Approach 1:
The patent divides the conventional FO-EB process into two independent modules: an electronic module with the bridge component and a packaging module with the multi-layer circuit structure. This segmentation allows the packaging module to undergo repeated thermal processes for circuit formation while the electronic module remains protected, thus maintaining packaging functionality without compromising bonding quality through void formation.
Solution Approach 2:
The bridge component is pre-assembled and encapsulated in the electronic module before the multi-layer circuit structure is formed in the packaging module. This preliminary action ensures that the bridge component is protected from the repeated thermal processes required to build the multi-layer circuit structure, preventing void formation while still achieving the desired packaging functionality with electrical interconnections.
Data Source
AI summary
An electronic package is provided and includes an electronic module and a packaging module stacked on each other, where the electronic module includes a bridge component, a plurality of conductive pillars and an encapsulation layer encapsulating the bridge component and the plurality of conductive pillars, and the packaging module includes a circuit structure and a plurality of electronic elements disposed on the circuit structure, such that the packaging module is stacked on the electronic module via a plurality of supporting elements, and the plurality of electronic elements are electrically bridged with each other via the circuit structure, the plurality of supporting elements and the bridge component. Therefore, the electronic module and the packaging module are fabricated separately to prevent the bridge component from going through too many thermal processes, thereby preventing voids of the bridge component from transferring to the packaging module.