Bridge Redistribution Package Layout for Reliable Wafer-Level Interconnects
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Solution Overview
Problem
Ensuring the reliability of wafer level packaging in semiconductor devices and integrated circuits is a challenge, particularly in the manufacturing of electronic apparatus such as cell phones and mobile equipment.
Innovation Solution
A manufacturing process involving a carrier with a de-bonding layer, a redistribution structure with conductive pillars and bridge structures, and encapsulation materials to form a package that ensures reliable interconnections and reduced size without additional substrates, using methods like flip-chip bonding and encapsulation processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafer level packaging is used to reduce package size, then the volume of the package is reduced, but the reliability of interconnections deteriorates
Solution Approach 1:
The patent segments the interconnection structure into multiple components including conductive pillars, bridge structures, and redistribution layers. This segmentation allows each component to be optimized independently for both size and reliability, with conductive pillars providing vertical connections and bridge structures providing horizontal interconnections within the compact wafer-level package
Solution Approach 2:
The patent transitions from traditional planar packaging to a three-dimensional stacked architecture with multiple redistribution layers at different heights. Conductive pillars extend vertically through the package, connecting dies in different layers, while bridge structures provide lateral connections. This dimensional change enables high-density interconnections within a reduced package volume while maintaining reliability through multiple redundant connection paths
2Reliability
If additional substrates are used to enhance reliability, then the interconnection reliability is improved, but the volume of the package increases
Solution Approach 1:
The patent merges the functions of multiple separate substrates into a single integrated carrier structure. The carrier supports multiple dies and contains the redistribution structure, conductive pillars, and bridge structures all within one unified substrate, eliminating the need for additional intermediate substrates while maintaining interconnection reliability
Solution Approach 2:
The carrier structure serves multiple functions simultaneously: it supports the dies, provides mechanical strength, contains the redistribution layers, and facilitates interconnections. This multi-functionality consolidates what would traditionally require multiple separate substrates into a single universal platform, reducing package volume while enhancing reliability
Data Source
AI summary
A package includes a first redistribution structure, a first die, a second die, a bridge structure, and an encapsulant. The first redistribution structure has a first side and a second side opposite to the first side. The first die and the second die are disposed on the first side of the first redistribution structure. The bridge structure is disposed on the second side of the first redistribution structure. The bridge structure includes routing patterns and connectors disposed on the routing patterns. A lateral dimension of the bridge structure is smaller than a lateral dimension of the first redistribution structure. The encapsulant is disposed on the second side of the first redistribution structure. The routing patterns and the connectors of the bridge structure are completely spaced apart from the encapsulant. The encapsulant is in physical contact with sidewalls of the bridge structure.