Bridge PCB Layout for External mmWave Antenna Integration
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Solution Overview
Problem
The integration of millimeter-wave antenna modules with wireless modem devices in electronic devices faces challenges such as increased manufacturing costs due to the need for re-designing flexible PCBs and interference from metal cases, which also impede heat dissipation and signal transmission.
Innovation Solution
A bridge printed circuit board is used to connect the millimeter-wave antenna module externally with the wireless modem device internally, utilizing a substrate with HF and signal connectors, and power vias to eliminate the need for a specifically designed flexible PCB, allowing the antenna module to be disposed on the device's surface and reducing interference from the case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible PCB is used to connect the millimeter-wave antenna module and the wireless modem device, then the antenna module can be integrated into the electronic device, but the manufacturing cost increases due to the need for re-designing the flexible PCB for different device types
Solution Approach 1:
The invention divides the connection system into separate segments: a standard bridge PCB with fixed connectors and cable assemblies. This modular segmentation allows the same bridge PCB design to be used across different device types, eliminating the need for re-designing flexible PCBs for each device variant while maintaining integration capability.
Solution Approach 2:
The bridge PCB is designed with universal connectors (HF connectors and antenna connectors) that can interface with different millimeter-wave antenna modules and wireless modem devices. This universal design enables a single bridge PCB model to serve multiple device types, reducing manufacturing costs through standardization.
2Temperature
If the case is made of metal to improve heat dissipation performance, then heat dissipation is enhanced, but the millimeter-wave signal transmission is blocked
Solution Approach 1:
The invention extracts the millimeter-wave antenna module from inside the metal case and positions it on the outer surface of the electronic device. This extraction removes the antenna from the signal-blocking environment while the metal case remains intact for heat dissipation, resolving the contradiction between thermal management and signal transmission.
Solution Approach 2:
The bridge PCB acts as an intermediary connection device, providing electrical connectivity between the internally mounted wireless modem device and the externally positioned antenna module. This allows the antenna to be placed outside the metal case for signal transmission while the modem remains inside for thermal management.
3Device complexity
If the antenna module is placed inside the electronic device, then integration is achieved, but the signal transmission is blocked by the metal case
Solution Approach 1:
The invention transitions the antenna module from a two-dimensional internal placement to a three-dimensional external surface mounting. By positioning the antenna on the outer surface of the device rather than inside, the signal transmission path is cleared of metal obstructions while maintaining device integration through the bridge PCB connection.
Data Source
AI summary
A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.