Bridge PCB Layout for Slim Multi-Board Processor Packaging
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Solution Overview
Problem
The challenge is to reduce the height of printed circuit board (PCB) structures while maintaining connectivity between multiple PCBs, which is essential for creating a slim electronic device structure without increasing manufacturing costs.
Innovation Solution
The solution involves using a bridge PCB that connects two PCBs in a parallel configuration, with a main hole in one PCB accommodating the second PCB and a bridge hole in the bridge PCB to house the application processor, and a main shield connected to the bridge PCB to cover the processor, allowing for a slim structure while maintaining connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If multiple PCBs are connected vertically to maintain connectivity, then signal transmission is ensured, but the overall height of the device increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement to a parallel arrangement with a bridge PCB connecting them horizontally. This dimensional change allows signal transmission while reducing the height parameter, as the bridge PCB extends laterally rather than vertically to establish connectivity between the first and second PCBs.
Solution Approach 2:
The bridge PCB serves as an intermediary component that connects the first PCB and second PCB in parallel. This mediator enables signal transmission between the two PCBs without requiring vertical stacking, thus maintaining connectivity while reducing the overall height of the device structure.
2Length of moving object
If a bridge PCB is introduced to reduce height, then the device becomes slimmer, but the structural complexity increases
Solution Approach 1:
The bridge PCB integrates multiple functions into a single component: it provides mechanical support for the parallel PCB arrangement, establishes electrical connectivity between the first and second PCBs, and houses the application processor. This merging of functions reduces the need for separate components and simplifies the overall structure despite the parallel configuration.
Solution Approach 2:
The application processor is nested within the bridge PCB structure, which itself is positioned between the first and second PCBs. This nested arrangement consolidates multiple components into a compact configuration, reducing height while managing structural complexity through hierarchical integration.
3Ease of manufacture
If the application processor is exposed without coverage, then manufacturing is simpler, but electromagnetic interference and noise increase
Solution Approach 1:
The bridge PCB serves multiple functions simultaneously: it provides mechanical support for the parallel PCB arrangement, establishes electrical connectivity, houses the application processor, and provides electromagnetic shielding through its ground connections. This multi-functionality addresses noise protection without adding separate shielding components, maintaining ease of manufacture.
Solution Approach 2:
The bridge PCB structure itself provides electromagnetic shielding for the application processor through its ground connections and positioning between the first PCB and second PCB. The structure serves its own shielding needs without requiring additional dedicated shielding components, simplifying the manufacturing process while protecting against EMI.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first printed circuit board (PCB) including a main hole, a second PCB inserted into the main hole and enclosed by the first PCB, a bridge PCB configured to connect the first PCB and the second PCB and disposed so as to overlap the first PCB and the second PCB, the bridge PCB including a bridge hole, an application processor disposed on the second PCB, inserted into the bridge hole, and enclosed by the bridge PCB, and a main shield connected to the bridge PCB and configured to cover the application processor.