Bridge Pick-Up Head for Micro-LED Transfer
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Solution Overview
Problem
Conventional pick and place techniques are unsuitable for transferring and bonding small semiconductor devices like micro-LEDs due to their tiny size, requiring innovative tools and methods for precise handling and bonding.
Innovation Solution
A pick-up tool (PUT) with a bridge pick-up head structure, including leg portions, a bridge base, and a tip, that allows for precise picking, placing, and bonding of semiconductor devices on a target substrate, featuring alignment markers and displacement features for accurate force measurement during thermocompression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pick and place techniques are used, then the process is simple and equipment is available, but the techniques are unsuitable for small semiconductor devices smaller than 100 μm
Solution Approach 1:
The pick-up tool is divided into distinct functional segments: a tip for device attachment, a bridge base portion for structural support, and leg portions for substrate contact. This segmentation allows each component to be optimized for its specific function while maintaining overall suitability for handling micro-LEDs smaller than 100 μm
Solution Approach 2:
The bridge pick-up head structure serves as an intermediary between the conventional pick and place equipment and the micro-LED devices. It provides a specialized interface with a tip for device attachment and leg portions for substrate contact, enabling precise handling of sub-100 μm devices that conventional tools cannot accommodate
2Manufacturing precision
If the pick-up tool places the semiconductor device precisely on the target substrate, then bonding accuracy is improved, but the risk of contact with previously bonded devices increases
Solution Approach 1:
The bridge pick-up head exhibits local quality through its geometric configuration where the leg portions are positioned to contact the target substrate at specific locations away from previously bonded devices. This localized contact arrangement enables precise placement while avoiding interference with adjacent bonded components
Solution Approach 2:
The bridge structure extends into the vertical dimension with leg portions that contact the substrate below the plane of bonded devices. This three-dimensional configuration allows the pick-up tool to achieve precise placement accuracy while maintaining clearance from previously bonded devices in the horizontal plane
3Productivity
If multiple semiconductor devices are transferred in parallel, then productivity is improved, but alignment precision becomes more difficult to maintain
Solution Approach 1:
The pick-up tool can be configured with multiple bridge pick-up heads, each independently capable of picking and placing devices. This segmentation enables parallel transfer operations while each head maintains its own alignment system, preserving precision across multiple simultaneous operations
Solution Approach 2:
The bridge pick-up head design provides a universal platform that can handle multiple devices in parallel while maintaining alignment precision. The standardized structure with alignment markers and controlled geometry allows the same tool design to be replicated across multiple heads, ensuring consistent alignment performance throughout the array
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable and precise transfer and bonding of micro-LEDs with reduced contact risk, facilitating the assembly of high-density display devices by supporting selective and parallel pick-up and placement of multiple devices with improved alignment and bonding accuracy.
Implementation Method 1
The tip attaches with a semiconductor device and places the semiconductor device on the target substrate
Implementation Method 2
The first and second leg portions contact the target substrate when the semiconductor device is placed on the target substrate
Implementation Method 3
displacement features for facilitating measurement of force-displacement during thermocompression bonding
Data Source
AI summary
A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.