Bridge Member Pre-Alignment for Multi-Chip Micro-Bump Bonding
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Solution Overview
Problem
Current multi-chip interconnection techniques face challenges in accurately aligning and supporting chips and bridge members due to the fragile nature of intermediate structures and the need for high precision in horizontal and vertical alignment, especially with decreasing solder volumes, which increases misalignment risks during the bridging process.
Innovation Solution
A chip handler apparatus with support surfaces and a bridge handler that enables pre-alignment of chips and bridge members, providing a controlled environment for precise alignment and support during the bridging process, using a chamber space with reduction gas for cleaning and preventing corrosion, and adjustable features to accommodate different chip thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If smaller bumps such as micro-bumps are employed to achieve dense interconnections, then interconnection density is improved, but alignment precision requirement increases making the process more difficult
Solution Approach 1:
The patent applies preliminary action by pre-aligning the bridge member with the first chip before bonding the second chip. The bridge member is positioned and aligned with the first chip's terminals in advance, creating a stable reference framework. This pre-alignment eliminates the need for complex real-time alignment during the bonding process, enabling the use of smaller micro-bumps while maintaining alignment accuracy within 5 micrometers horizontally and 2 micrometers vertically.
2Device complexity
If multiple chips are bonded sequentially without intermediate support, then device complexity is reduced, but reliability of the bridging process deteriorates due to fragile intermediate structures
Solution Approach 1:
The patent introduces a carrier as an intermediary component that supports the chips and bridge member during the bonding process. The carrier provides a stable platform that holds the first chip, bridge member, and second chip in predetermined positions, preventing misalignment and supporting fragile intermediate structures. This intermediary carrier enables reliable simultaneous bonding of multiple chips while maintaining process simplicity through automated placement.
3Ease of operation
If chips are aligned and bonded without pre-alignment framework, then ease of operation is improved, but manufacturing precision deteriorates due to cumulative alignment errors
Solution Approach 1:
The patent applies segmentation by dividing the alignment process into distinct stages: first, the bridge member is aligned and bonded to the first chip; second, the second chip is aligned and bonded to the bridge member. The bridge member itself is segmented into terminal regions that interface with each chip. This segmented approach with the bridge member as a reference framework enables accurate alignment (within 5 micrometers horizontally and 2 micrometers vertically) while simplifying operation through sequential, standardized bonding steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures accurate alignment and support of chips and bridge members, reducing misalignment and enhancing the reliability of the bridging process, allowing for simultaneous bonding to a substrate while maintaining the integrity of the components.
Implementation Method 1
a gas supplier for suppling reduction gas into the chamber space to clean the first sets of terminals of the first chip and the second chip and/or the terminals of the bridge member
Data Source
AI summary
Interconnecting a first chip and a second chip by a bridge member includes a chip handler for handling the first chip and the second chip. Each of the first chip and the second chip has a first surface including a first set of terminals and a second surface opposite to the first surface. The chip handler has an opening and at least one support surface for supporting the first surfaces of the first chip and the second chip when the first chip and the second chip are mounted to the chip handler. A chip support member supports the first chip and the second chip from the second surfaces, and a bridge handler is provided for inserting the bridge member through the opening of the chip handler and for placing the bridge member onto the first sets of terminals of the first chip and the second chip.