Bridge Rectifier Component In-Line Packaging Heat Dissipation
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Solution Overview
Problem
Conventional single-phase and three-phase bridge rectifiers have poor heat dissipation performance and complex manufacturing processes due to the multilayer connection of diodes, leading to inconsistent and unreliable products.
Innovation Solution
A bridge rectifier circuit component using in-line electronic components with a lead frame, where two diode dies are in contact with the same surface of a carrier board, simplifying the packaging process and improving heat dissipation through exposed heat dissipation parts and eliminating the need to flip diodes during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If four rectifier diodes are packaged in a device by fully insulated package manner, then the multilayer relationship between diodes is formed, but the heat dissipation performance becomes poor
Solution Approach 1:
The patent divides the bridge rectifier into two separate in-line electronic components instead of packaging all four diodes in a single multilayer structure. Each component contains two rectifier diodes with independent packaging, allowing heat to dissipate from each die separately rather than being trapped in a fully insulated multilayer package. This segmentation resolves the contradiction by maintaining structural organization while improving thermal performance.
Solution Approach 2:
The patent transitions from a vertical multilayer stacking arrangement to a horizontal in-line arrangement where diodes are positioned side-by-side on the same plane. This dimensional change allows heat to dissipate laterally across a larger surface area rather than being confined to vertical layers, thereby improving heat dissipation performance while maintaining a compact form factor.
2Device complexity
If diode die are flipped during the die package process, then the multilayer connection is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
Instead of flipping the diode dies during packaging to achieve multilayer connections, the patent inverts the approach by keeping all dies in their original orientation and arranging them in-line on the same plane. This eliminates the need for complex flipping operations and die reorientation, significantly simplifying the manufacturing process while achieving the required electrical connections through a different spatial arrangement.
3Reliability
If fully insulated package manner is used, then the diodes are protected, but the heat dissipation performance deteriorates
Solution Approach 1:
The patent applies different packaging characteristics to different regions: the diodes receive protective insulation where needed for electrical isolation and protection, while the heat dissipation paths remain partially exposed or use thermally conductive materials. This localized approach to insulation allows protection of individual diodes without creating a fully insulated multilayer structure that would trap heat, thereby resolving the contradiction between protection and thermal performance.
Data Source
AI summary
The present disclosure illustrates an electronic component applicable single-phase or three-phase bridge rectifier circuit. The electronic component includes a lead frame, a first die, and a second die. The first and second pins of the lead frame are connected to the first and second boards respectively, and a surface of the first die opposite to the first board is connected to the second board, a surface of the second die opposite to the second board is connected a third pin of the lead frame. The bridge rectifier circuit may include two or three electronic components, and the first pins of the electronic components are connected to each other as a first DC output terminal, the third pins are electrically connected to each other as a second DC output terminal, and the second pins are served as AC input terminals, respectively.