Bridge Spring Pad Package for Thin, Reliable Chip Interconnects
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Solution Overview
Problem
There is an ongoing need for packages with substrates and integrated devices that perform better and are smaller in size, while maintaining effective electrical connections.
Innovation Solution
A package configuration that includes a substrate, a bridge with spring pads, and integrated devices connected via solder and pillar interconnects, allowing for low-cost, high-density connections and reduced assembly cycle times, with the bridge being partially embedded in the substrate to minimize package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bridge is added to connect integrated devices to the substrate, then electrical connections are improved, but package complexity increases
Solution Approach 1:
The package is divided into functional segments: the substrate provides mechanical support and power distribution, while the bridge structure provides dedicated electrical interconnection pathways. This segmentation allows each component to be optimized independently - the substrate for mechanical stability and the bridge for electrical performance - thereby improving overall connection reliability without proportionally increasing total package complexity.
Solution Approach 2:
The bridge structure acts as an intermediary component between the integrated devices and the substrate. Rather than directly connecting devices to the substrate, the bridge mediates the electrical connection, providing a specialized interface that optimizes signal transmission while isolating the complexity of the interconnection architecture from both the devices and the substrate.
2Ease of manufacture
If spring pads are used in the bridge, then ease of manufacture is improved, but connection stability may worsen
Solution Approach 1:
The spring pads introduce a dynamic, elastic element into the otherwise rigid bridge structure. This elasticity allows the connection to adapt to manufacturing tolerances and thermal expansion differences, absorbing stresses that would otherwise compromise connection stability. The spring mechanism provides a compliant interface that maintains reliable electrical contact while accommodating variations in the assembly process.
3Volume of moving object
If the bridge is partially embedded in the substrate, then package size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The bridge structure is partially nested within the substrate, with portions of the bridge embedded in recesses or cavities of the substrate. This nesting arrangement allows the bridge to occupy three-dimensional space efficiently, reducing the overall package thickness by utilizing vertical space rather than extending horizontally. The embedded portions provide mechanical anchoring while the exposed portions maintain electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables compact packages with improved electrical connections and reduced assembly time, achieving thinner profiles and lower costs through the use of flexible spring pads that facilitate efficient joint coupling between integrated devices.
Implementation Method 1
a bridge coupled to the substrate, wherein the bridge comprises a plurality of spring pads
Data Source
AI summary
A package comprising a substrate; a first integrated device coupled to the substrate through at least a first plurality of solder interconnects; a second integrated device coupled to the substrate through at least a second plurality of solder interconnects; and a bridge coupled to the substrate, wherein the bridge comprises a plurality of spring pads.