Bridge Stack IC Package-on-Package for High Density Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current multi-chip packages face challenges in integrated circuit density, assembly process yield, and manufacturing complexity, particularly with vertically stacked circuits, leading to increased costs and reliability issues due to the inability to test individual integrated circuits before assembly and the use of additional structures like printed circuit boards and interposers.
Innovation Solution
A bridge stack integrated circuit package-on-package system is developed, comprising a first and second integrated circuit package system with a bridge integrated circuit package system acting as a bridge over a separation between the two substrates, using bridge interconnects like solder balls or conductive adhesive, which provides mechanical support and electrical connections while allowing for individual testing and improved assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vertically stacked integrated circuits are used in multi-chip packages, then integrated circuit density is improved, but assembly process yield deteriorates due to inability to test individual circuits before assembly
Solution Approach 1:
The patent applies preliminary action by enabling testing of integrated circuits before they are assembled into the final multi-chip package. Individual circuits can be tested and identified as known-good-die (KGD) prior to assembly, allowing defective circuits to be replaced or reworked without damaging other components. This preliminary testing step resolves the contradiction by maintaining high circuit density while improving assembly yield through early defect detection.
2Weight of stationary object
If vertically stacked integrated circuits are used, then integrated circuit size and weight are reduced, but manufacturing complexity increases due to difficulty in testing and determining failure modes
Solution Approach 1:
The patent applies segmentation by dividing the vertically stacked multi-chip package into individually accessible circuit components during the manufacturing process. This segmentation allows each integrated circuit to be tested and evaluated separately despite the vertical stacking configuration, reducing manufacturing complexity by enabling modular testing and failure mode analysis without requiring destruction of the entire stack.
3Quantity of substance
If additional structures like printed circuit boards and interposers are used to connect integrated circuits, then integrated circuit density is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent applies merging by integrating the connection functions previously performed by separate printed circuit boards and interposers directly into the vertically stacked multi-chip package structure. The circuits are electrically connected through direct vertical interconnections within the package, eliminating the need for additional intermediate substrate structures. This reduces device complexity and manufacturing cost while maintaining high integrated circuit density.
Data Source
AI summary
A bridge stack integrated circuit package-on-package system is provided including forming a first integrated circuit package system having a first substrate, forming a second integrated circuit package system having a second substrate, and mounting a bridge integrated circuit package system on the first substrate and on the second substrate.