Bridge Substrate Layout for Backside Power Distribution Packaging
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Solution Overview
Problem
There is a need for improved electronic packages that enhance performance while reducing size, particularly in providing efficient electrical paths and power distribution networks within a compact and thin form factor.
Innovation Solution
The package design incorporates a substrate with a bridge structure, featuring bridge substrates, dielectric layers, interconnects, and interconnects that extend through the substrate, providing electrical paths for signals, power, and ground, and includes passive devices and encapsulation layers to enhance power delivery and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional substrate structure is used, then the package size can be reduced, but power delivery and signal integrity deteriorate
Solution Approach 1:
The substrate is divided into a first substrate portion and a second substrate portion with a bridge structure connecting them. This segmentation allows the package to maintain a compact overall size while the bridge structure provides dedicated electrical paths that improve power delivery and signal integrity between the two substrate portions.
Solution Approach 2:
The bridge structure extends in a direction substantially perpendicular to the major surface of the substrate, utilizing the vertical dimension to create electrical paths. This three-dimensional approach allows electrical connections to be established without increasing the planar footprint of the package, thus maintaining compact size while improving electrical performance.
2Length of stationary object
If the package thickness is reduced, then the overall size is minimized, but manufacturing complexity increases
Solution Approach 1:
The bridge structure is formed by extending interconnects through the substrate during the substrate fabrication process itself, before final assembly. This preliminary formation of the bridge structure integrates the complex three-dimensional interconnect architecture into the substrate manufacturing flow, reducing the need for additional post-assembly steps and simplifying overall manufacturing despite the reduced package thickness.
Data Source
AI summary
A package comprising a substrate, a bridge located in the substrate, a first integrated device coupled to the substrate and a second integrated device coupled to the substrate. The bridge includes a bridge substrate; at least one first bridge dielectric layer coupled to a first surface of the bridge substrate; at least one first bridge interconnect located in the at least one first bridge dielectric layer; at least one second bridge dielectric layer coupled to a second surface of the bridge substrate; at least one second bridge interconnect located in the at least one second bridge dielectric layer; and at least one bridge interconnect that extends through the at least one first bridge dielectric layer and the bridge substrate.