Bridge-in-Substrate Packaging for High-Density Interconnects
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Solution Overview
Problem
Conventional microelectronic packages face limitations in interconnect density, signal transfer speed, and miniaturization due to the use of solder attachments, which are costly and complex to manufacture.
Innovation Solution
The introduction of a microelectronic structure with a substrate and a bridge component in a cavity, allowing for higher interconnect density and flexibility without the need for expensive manufacturing operations, using a bridge component with finer pitch conductive contacts and a substrate with conductive pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder attachment is used in conventional microelectronic packages, then mechanical strength is improved, but interconnect density is limited
Solution Approach 1:
The package substrate is divided into multiple layers (first substrate layer, second substrate layer) with through-substrate vias connecting them. This segmentation allows independent optimization of each layer for interconnect density while maintaining overall mechanical strength through the via connections.
Solution Approach 2:
The invention transitions from planar interconnects to three-dimensional vertical interconnects using through-substrate vias. This adds a vertical dimension to interconnect density, allowing higher density without compromising mechanical strength that would be required in planar configurations.
2Strength
If solder attachment is used in conventional microelectronic packages, then mechanical strength is improved, but signal transfer speed is limited
Solution Approach 1:
The invention extracts the solder attachment function from the primary interconnect structure and replaces it with through-substrate vias for signal transmission. This separation allows solder to be used only for mechanical bonding while the via structure optimizes signal transfer speed through controlled impedance and shorter signal paths.
Solution Approach 2:
Through-substrate vias act as intermediaries between the solder-bonded substrate layers and the final interconnect structure. These vias provide optimized signal transmission paths with controlled electrical characteristics, improving signal transfer speed while the solder maintains mechanical strength.
3Strength
If conventional solder attachment methods are used, then mechanical strength is improved, but miniaturization is limited
Solution Approach 1:
The invention utilizes vertical stacking with through-substrate vias to achieve higher interconnect density in the vertical dimension rather than expanding horizontally. This enables miniaturization of the package footprint while maintaining mechanical strength through the vertical via structure.
Solution Approach 2:
The multi-layer substrate structure with embedded vias creates a nested configuration where conductive paths are integrated within the substrate layers themselves. This nesting eliminates the need for larger external interconnect structures, enabling miniaturization while preserving mechanical integrity.
4Quantity of substance
If through-substrate vias are used to achieve higher interconnect density, then manufacturing precision requirements increase
Solution Approach 1:
Through-substrate vias are formed during the substrate fabrication process before final assembly, using standard PCB manufacturing techniques. This preliminary formation of vias with controlled dimensions eliminates the need for post-assembly precision operations, reducing overall manufacturing precision requirements while achieving high interconnect density.
Data Source
AI summary
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.