Bridge-in-Substrate Interconnects for Dense Microelectronic Packaging
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Solution Overview
Problem
Conventional microelectronic packages face limitations in interconnect density, signal transfer speed, and miniaturization due to the use of solder for attaching dies to organic package substrates.
Innovation Solution
The development of microelectronic structures that include a substrate with a bridge component in a cavity, allowing for higher interconnect density without the need for costly manufacturing operations like fine-pitch via formation and first-level interconnect plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If solder is used to attach dies to organic package substrates, then manufacturing process is simple, but interconnect density is limited
Solution Approach 1:
The patent introduces a bridge component that extends in the z-dimension (vertical direction) above the substrate surface, transforming a planar 2D interconnect architecture into a 3D structure. This vertical dimension allows multiple interconnects to be stacked and routed through the bridge, dramatically increasing interconnect density without requiring proportional increases in substrate area or manufacturing complexity
Solution Approach 2:
The bridge component contains multiple conductive interconnects nested within its structure, with different interconnects routed through different portions of the bridge. This nesting approach allows multiple signal paths to be contained within a single vertical element, achieving high interconnect density while maintaining a compact footprint and avoiding the need for complex fine-pitch via formation
2Speed
If conventional solder attachment is used, then manufacturing cost is low, but signal transfer speed is limited
Solution Approach 1:
The patent extracts the signal transfer function from the traditional planar substrate-solder-die architecture and relocates it to the vertical bridge structure. By taking out the interconnect routing function and placing it in the vertical dimension, the signal path is shortened and optimized, enabling faster signal transfer while the bridge component itself becomes the focal point for advanced interconnect technologies
Solution Approach 2:
By moving interconnect routing into the vertical z-dimension through the bridge component, the patent creates shorter signal paths and reduces signal attenuation. This dimensional change allows for higher speed signal transfer because signals travel shorter distances and can utilize optimized vertical routing paths rather than long lateral traces on the substrate
3Volume of moving object
If interconnect density is increased, then miniaturization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent resolves the miniaturization vs. manufacturing complexity contradiction by utilizing the vertical z-dimension for interconnect routing. Instead of increasing lateral interconnect density on the substrate (which would require finer pitch and more complex manufacturing), the bridge component provides vertical stacking and routing capabilities that achieve miniaturization through height rather than width, avoiding the need for costly fine-pitch via formation and plating operations
Data Source
AI summary
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.