Embedded Interconnect Bridge Power Rail Design
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Solution Overview
Problem
Existing semiconductor die packaging technologies, such as Embedded Interconnect Bridge (EmIB) architectures, face challenges in providing reliable power connections to interconnect bridges within the package due to their thin structure, which limits the quality of data communication and increases stress on the bridge.
Innovation Solution
Incorporating a power rail within the package substrate that extends above the bridge attach region, allowing direct power supply from outside the package to the interconnect area, separate from data communication connectors, and using conductive vias and metal layers to ensure efficient power distribution to the dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the interconnect bridge is made thin to reduce package size, then the package size is reduced, but the power connection reliability deteriorates
Solution Approach 1:
The power delivery system is segmented into multiple independent components: external power connections to the substrate, substrate power rails, via connections through the substrate, and bridge attach region power contacts. This segmentation allows the thin bridge to receive power through multiple distributed points rather than relying on a single thick structure, resolving the contradiction between thin bridge design and power connection reliability.
Solution Approach 2:
The substrate acts as an intermediary between external power sources and the thin interconnect bridge. Power rails on the substrate and conductive vias serve as intermediate power delivery paths that bridge the gap between external connections and the bridge attach region, enabling reliable power delivery without requiring the bridge itself to be thick.
2Device complexity
If power is supplied through the thin bridge structure, then the package structure is simplified, but the stress on the bridge increases
Solution Approach 1:
The power delivery function is extracted from the bridge structure itself and relocated to the substrate level. Power rails and vias are implemented in the substrate separate from the bridge, allowing the bridge to focus solely on interconnect functions without bearing power delivery stress, thus reducing mechanical stress while maintaining structural simplicity.
Solution Approach 2:
Power delivery is moved from a vertical through-bridge path to a lateral substrate-based path. Power rails extend laterally across the substrate to the bridge attach region, and via connections provide vertical access points. This dimensional redistribution eliminates stress concentration in the thin bridge while maintaining a simplified overall package structure.
3Measurement precision
If the bridge attach region uses C4 high density interconnect area, then the data communication quality is improved, but the power delivery capability is limited
Solution Approach 1:
The bridge attach region is designed with local quality differentiation: C4 high density interconnect structures provide high-quality data communication paths, while separate power rails and dedicated power contacts provide robust power delivery. This local specialization allows each function to be optimized independently, resolving the contradiction between data communication quality and power delivery capability.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, lateral power distribution through power rails, vertical power access through vias, and signal routing. This multi-functionality allows the system to achieve both high-quality data communication via C4 interconnects and adequate power delivery through the substrate's integrated power delivery network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances data communication quality by providing superior power supply directly to the bridge attach region, reducing stress on the bridge and improving power delivery efficiency within the package.
Implementation Method 1
using conductive vias and metal layers to ensure efficient power distribution to the dies
Data Source
Figure 1
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AI summary
An external direct connection usable for an embedded interconnect bridge package is described. In one example, a package has a substrate, a first semiconductor die having a first bridge interconnect region, and a second semiconductor die having a second bridge interconnect region. The package has a bridge embedded in the substrate, the bridge having a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region, and an external connection rail extending between the interconnect bridge and the first and second semiconductor dies to supply external connection to the first and second bridge interconnect regions.