Bridge Support Structure for Semiconductor Module Assembly
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Solution Overview
Problem
The increasing complexity and size of semiconductor devices lead to lower yields due to random defects, necessitating a solution to enhance communication between split devices while managing stress and fragility in bridge support structures during assembly.
Innovation Solution
A module assembly comprising two semiconductor devices connected by a bridge support structure with larger third bonding pads at a greater pitch than second bonding pads, using a solder hierarchy to anchor the bridge support structure and relieve stress, ensuring reliable solder connections and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are split in size to reduce yield loss, then yield loss is reduced, but the amount of I/O required to communicate between devices increases
Solution Approach 1:
The semiconductor device is divided into multiple smaller dies (first semiconductor device and second semiconductor device) to reduce yield loss. Each die is smaller and less prone to defects, but they are connected through a bridge support structure to function as a unified system with increased I/O capacity.
Solution Approach 2:
A bridge support structure is introduced as an intermediary component to connect the multiple semiconductor dies. This bridge provides the necessary I/O pathways and mechanical support, enabling communication between split devices while managing the increased complexity of inter-device communication.
2Productivity
If bridge support structure is used to connect semiconductor devices, then communication between devices is enabled, but stress and fragility during assembly increase
Solution Approach 1:
The bridge support structure incorporates bonding pads of different sizes (second bonding pads and larger third bonding pads) at different locations. The larger third bonding pads are strategically positioned to provide enhanced mechanical support and stress distribution at critical anchor points, while smaller second bonding pads handle signal transmission, optimizing both communication and structural reliability.
Solution Approach 2:
The bridge support structure is designed with larger third bonding pads that serve as stress-relief anchors before assembly stresses occur. These enlarged pads pre-positioned at strategic locations cushion against thermal expansion stresses and mechanical loads during the assembly process, preventing delamination and solder joint failure.
3Reliability
If larger third bonding pads at greater pitch are used on bridge support structure, then stress is relieved and delamination is prevented, but manufacturing complexity increases
Solution Approach 1:
Instead of uniformly enlarging all bonding pads, the design applies local quality by making only specific third bonding pads larger than the second bonding pads. This selective enlargement at critical stress points provides the necessary mechanical strength and stress relief while keeping other bonding pads smaller and easier to manufacture, thus balancing reliability with manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient communication between semiconductor devices, reduces yield loss by stabilizing the bridge support structure and preventing underfill delamination, while maintaining reliable solder joints and assembly integrity.
Implementation Method 1
the first semiconductor device and the second semiconductor device each having second and third bonding pads joined to second and third bonding pads on the bridge support structure by a second solder and a third solder, respectively
Implementation Method 2
heating the first and second semiconductor devices and the bridge support structure a first time so as to cause reflow of the third solder to form a first solder connection
Data Source
AI summary
A module including a first semiconductor device, a second semiconductor device, a bridge support structure and a base substrate. The semiconductor devices each having first bonding pads having a first solder joined with the base substrate and the semiconductor devices each having second and third bonding pads joined to second and third bonding pads on the bridge support structure by a second solder and a third solder, respectively, on the second and third bonding pads; the semiconductor devices positioned adjacent to each other such that the bridge support structure joins to both of the semiconductor devices by the second and third solders wherein the third bonding pads are larger than the second bonding pads and the third bonding pads are at a larger pitch than the second bonding pads.