Multi-Die Packaging Structure with Bridge and TSV Interconnects
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Solution Overview
Problem
The challenge lies in improving the manufacturing yield and reducing costs of packaging structures that integrate multiple active dies, as existing methods struggle to efficiently connect and encapsulate these dies while maintaining quality.
Innovation Solution
A packaging structure and manufacturing method that include a bridge die, through silicon via die, first and second active dies, and a redistribution circuit structure, where the first encapsulant covers the through silicon via and bridge die, and the second encapsulant covers the active dies, with the redistribution circuit connected to the through silicon via die, allowing for electrical connections between the active dies and improved integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple active dies are integrated in one packaging structure, then functionality and performance are improved, but manufacturing complexity and costs increase
Solution Approach 1:
The packaging structure is divided into distinct functional modules: active dies for computation, bridge dies for interconnection, and through-silicon via dies for vertical routing. This segmentation allows each component to be manufactured and tested independently before final assembly, reducing overall manufacturing complexity while maintaining high functionality integration.
Solution Approach 2:
Bridge dies and through-silicon via dies serve as intermediary components that facilitate electrical connections between multiple active dies. These intermediary elements simplify the integration process by providing standardized connection interfaces, thereby reducing manufacturing complexity despite the high number of integrated functional units.
2Power
If multiple active dies are integrated in one packaging structure, then performance is improved, but manufacturing yield decreases
Solution Approach 1:
The bridge dies and through-silicon via dies are prepared and tested before the final assembly with active dies. This preliminary action allows for early detection of manufacturing defects, enabling corrective measures before costly active dies are integrated, thereby improving manufacturing yield while maintaining high performance through proper die selection and arrangement.
Solution Approach 2:
The manufacturing process incorporates feedback mechanisms where test results from bridge dies and through-silicon via dies inform subsequent assembly decisions. This feedback loop allows for real-time quality control, ensuring that only properly functioning components are integrated, thus maintaining high yield despite the complexity of multi-die integration.
3Adaptability or versatility
If multiple active dies are integrated in one packaging structure, then functionality is improved, but manufacturing costs increase
Solution Approach 1:
Multiple functional elements (active dies, bridge dies, through-silicon via dies, and encapsulants) are merged into a single integrated packaging structure. This merging reduces the need for separate packaging and interconnection solutions, thereby lowering overall manufacturing costs while achieving high functionality integration through a unified design approach.
Solution Approach 2:
The bridge dies and through-silicon via dies serve multiple functions: electrical interconnection, mechanical support, and thermal management. This multi-functionality reduces the number of separate components needed, simplifying the manufacturing process and reducing costs while maintaining high functionality integration across the packaging structure.
Data Source
AI summary
A packaging structure includes a bridge die, a through silicon via die, a first encapsulant, a first active die, a second active die, a second encapsulant, and a redistribution circuit structure. The first encapsulant covers the through silicon via die and the bridge die. The first active die is electrically connected to the bridge die and the through silicon via die. The second active die is electrically connected to the bridge die. The second encapsulant covers the first active die and the second active die. The redistribution circuit structure is electrically connected to the through silicon via die. The through silicon via die is disposed between the first active die and the redistribution circuit structure. A manufacturing method of a packaging structure is also provided.