Bridging Component for Compact Optical Signal Coupling

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Solution Overview

Problem

Existing electronic devices with integrated silicon photonics and optical engines face challenges in compact packaging due to large dimensions of fibers or polymeric waveguides, leading to increased package size and reduced flexibility, and complex manufacturing processes with high costs.

Innovation Solution

The use of a bridging component that optically couples transducers with dimensions closer to those of the optical engines, allowing for smaller connections and increased packaging flexibility, and simplifying the manufacturing process by eliminating the need for multiple optical coupling types.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If fibers or polymeric waveguides are used for optical signal transmission between photonic components, then optical signal transmission is achieved, but the package size increases and packaging flexibility is reduced

Engineering Contradiction:
Improveoptical signal transmissionVSAvoidpackage size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent changes the dimensional parameters of the waveguide from large (fibers/polymeric waveguides) to small (dimensions closer to optical engines), enabling compact packaging while maintaining optical signal transmission functionality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The bridging component serves as an intermediary element that optically couples transducers with dimensions suitable for compact packaging, eliminating the need for large fibers or polymeric waveguides while enabling optical signal transmission

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If fibers or polymeric waveguides are used for optical signal transmission, then optical connection is established, but manufacturing process becomes complex and costs increase

Engineering Contradiction:
Improveoptical connectionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The bridging component acts as a simplified intermediary that replaces complex multi-type optical coupling requirements with a single, standardized coupling interface, reducing manufacturing complexity and costs

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The bridging component provides a universal optical coupling solution that eliminates the need for multiple different optical coupling types, simplifying the manufacturing process while maintaining reliable optical connection

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the size of the package, enhances packaging flexibility, and lowers manufacturing costs by using a compact integrated waveguide ensemble for optical signal transmission between transducers.

Implementation Method 1

the bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS20240345343A1Electronic device
Publication Date: 2024.10.17 ADVANCED SEMICON ENG INC
  • US20240345343A1 patent drawing
  • US20240345343A1 patent drawing
  • US20240345343A1 patent drawing

AI summary

An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.