Bridging Device Signal Path Shortening for Motherboard Cost Reduction
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Solution Overview
Problem
Conventional electronic devices with distributed computing architectures face increased manufacturing costs due to the need for higher-cost materials to improve signal quality and reduce signal losses between processors and peripheral circuits, which complicates the design and increases costs.
Innovation Solution
The introduction of a bridging device with a multilayer circuit board and connectors that reduces signal path length and insertion loss, allowing for improved signal quality and integrity without modifying the motherboard materials, thereby reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If materials of the overall motherboard are replaced with materials at higher costs, then the quality of signals transmitted on the motherboard is improved and signal losses are reduced, but the manufacturing costs of the electronic device increase
Solution Approach 1:
The patent applies local quality by implementing a hybrid motherboard architecture where only specific portions (the add-in card and riser card sections) use high-frequency signal transmission paths with appropriate material selections, while the main motherboard can use cost-effective materials. This localized application of high-quality materials to critical signal paths achieves improved signal quality without requiring expensive materials throughout the entire motherboard, thereby resolving the contradiction between signal quality and manufacturing cost.
Solution Approach 2:
The patent segments the signal transmission path into multiple sections: the main motherboard connection, the add-in card, and the riser card. By dividing the system into these segments, the invention allows different material and design optimizations for each segment. The riser card and add-in card can be designed with materials and structures optimized for high-frequency signals, while the main motherboard uses standard cost-effective materials, thus achieving good signal quality at lower overall manufacturing cost.
2Loss of energy
If materials of the overall motherboard are replaced with materials at higher costs, then signal losses are reduced, but the manufacturing costs of the electronic device increase
Solution Approach 1:
The patent applies local quality by implementing a hybrid motherboard architecture where only specific portions (the add-in card and riser card sections) use high-frequency signal transmission paths with appropriate material selections, while the main motherboard can use cost-effective materials. This localized application of high-quality materials to critical signal paths achieves improved signal quality without requiring expensive materials throughout the entire motherboard, thereby resolving the contradiction between signal quality and manufacturing cost.
Solution Approach 2:
The patent segments the signal transmission path into multiple sections: the main motherboard connection, the add-in card, and the riser card. By dividing the system into these segments, the invention allows different material and design optimizations for each segment. The riser card and add-in card can be designed with materials and structures optimized for high-frequency signals, while the main motherboard uses standard cost-effective materials, thus achieving good signal quality at lower overall manufacturing cost.
3Reliability
If a bridging device is introduced to reduce signal path length, then signal quality and integrity are improved, but the device complexity increases
Solution Approach 1:
The riser card in the patent serves multiple functions: it acts as a signal transmission medium between the add-in card and motherboard, provides mechanical support and structural alignment, and enables high-frequency signal transmission without requiring complex modifications to the main motherboard. This multi-functional design reduces overall device complexity by consolidating several functions into a single component rather than requiring separate complex systems for each function.
Solution Approach 2:
The riser card serves as an intermediary component between the add-in card and the main motherboard. It mediates the signal transmission by providing a dedicated high-frequency signal path, thereby isolating the complexity of high-frequency design from the main motherboard. This intermediary approach allows the main motherboard to remain simple while achieving high signal integrity through the specialized riser card.
Data Source
AI summary
An electronic device includes a motherboard, a bridging device, and an add-in card. The motherboard includes a processor, a first circuit board, and a first connector. The processor is coupled to the first connector through the first circuit board. The bridging device includes a second circuit board and a second connector and is disposed on the motherboard and coupled to the first connector. The second connector is coupled to the first connector through the second circuit board. The add-in card includes a third circuit board and a peripheral circuit and is disposed on the bridging device and coupled to the second connector. The peripheral circuit is coupled to the second connector through the third circuit board. The processor is coupled to the peripheral circuit through a signal path including the first circuit board, the first connector, the second circuit board, the second connector, and the third circuit board.