Brittle Particle Crosslinked Laminate for Dense Porous Substrates
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Solution Overview
Problem
Conventional methods struggle to form dense, high-quality brittle material structures on porous substrates without causing thermal or physical damage, maintaining crystallinity, and achieving excellent mechanical and electrical properties while ensuring cost-effectiveness and practicality.
Innovation Solution
A brittle material crosslinked structure region is formed by crosslinking brittle material particles with a higher free energy than the particles themselves, creating a stable, three-dimensional network that prevents particle movement and maintains crystallinity, using a manufacturing method involving plasma activation and collision crushing to achieve high adhesion and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thermal spraying method is used to form brittle material structure, then thick film structure can be produced, but phase transformation during melting and solidification causes cracks and makes it difficult to produce dense structure
Solution Approach 1:
The invention changes the fundamental parameter of the deposition process from thermal melting to cold physical vapor deposition. By using sputtering instead of thermal spraying, the material is deposited without undergoing phase transformation, thereby avoiding cracks while still achieving thick film formation. This parameter change resolves the contradiction between film thickness and structure density.
Solution Approach 2:
The invention deliberately avoids phase transitions during the deposition process. By using physical vapor deposition (sputtering) rather than thermal spraying, the material remains in the solid state throughout the process, preventing the melting and solidification cycles that cause cracks. This approach maintains structure density while enabling thick film formation.
2Ease of manufacture
If sintering method is used to manufacture brittle material structure, then structure can be formed, but high temperature heating causes thermal effects on surroundings limiting manufacturing on different members
Solution Approach 1:
The invention replaces the thermal field (heating) with a physical field (sputtering deposition). Instead of using high-temperature sintering to form the structure, the method uses ion bombardment and physical vapor deposition to build up the brittle material layer at room temperature or low temperature, eliminating thermal effects on surrounding members while still achieving structure formation.
Solution Approach 2:
The invention fundamentally changes the temperature parameter from high-temperature sintering to room temperature or low-temperature deposition. By using sputtering instead of sintering, the process can be conducted without high-temperature heating, thereby avoiding thermal effects on surrounding members while still enabling structure formation through physical vapor deposition.
3Ease of manufacture
If conventional aerosol deposition method is used, then structure can be formed by spraying fine particles, but particle aggregation reduces adhesion and mechanical strength
Solution Approach 1:
The invention applies preliminary action by pre-treating the substrate surface before deposition and controlling the deposition conditions to ensure proper particle adhesion. By preparing the substrate surface appropriately and controlling the sputtering parameters, the method prevents particle aggregation and ensures strong adhesion from the beginning of the deposition process.
Solution Approach 2:
The invention replaces the mechanical spraying method with a physical vapor deposition method (sputtering). Instead of mechanically spraying particles that tend to aggregate, the method uses ion bombardment to deposit material atom-by-atom or molecule-by-molecule, ensuring uniform distribution and strong adhesion without aggregation issues.
4Manufacturing precision
If fine particles are made finer to increase structure density, then density improves, but processing difficulty increases due to brittle properties
Solution Approach 1:
The invention replaces mechanical processing methods with physical vapor deposition. Instead of mechanically handling and processing fine particles (which is difficult due to brittleness), the method uses sputtering to deposit the material in a controlled physical field, eliminating the need for mechanical processing of fine particles while achieving high structure density.
Solution Approach 2:
The invention changes the processing method from mechanical handling to physical field-based deposition. By using sputtering instead of mechanical processing, the method can effectively handle fine particles without the difficulties associated with brittle material processing, while achieving high structure density through controlled atomic or molecular deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of dense, high-quality brittle material structures with improved mechanical and electrical properties, maintaining crystallinity and achieving excellent adhesion and coverage without thermal or physical damage, thus addressing the challenges of conventional methods.
Implementation Method 1
activating a surface of the fine particles to generate an active region
Implementation Method 2
a surface of the fine particles is activated to generate an active region
Implementation Method 3
ejecting the fine particles having a small deformation used to form the structure to a base material, and the fine particles join to each other via the active region
Data Source
AI summary
A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.