Brittle Substrate Trench Line Division Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Brittle substrates, such as glass, are prone to unintentional division during transportation or storage after forming a scribe line, as vertical cracks can penetrate further in the thickness direction, and there is a need to define the division position accurately before the intended breaking step.
Innovation Solution
A method involving forming a trench line on the substrate without a crack, which serves as a defined position for division, and subsequently extending a crack along this trench line to trigger the actual division, ensuring the substrate is not divided unintentionally before the intended time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a scribe line is formed on the substrate and then the substrate is transported or stored before the breaking step, then the substrate can be processed in between, but the substrate may be divided unintentionally during transportation or storage
Solution Approach 1:
The method forms a trench line that defines the future division position in advance, but deliberately delays crack formation until the breaking step. This preliminary definition of the division position without immediate crack creation allows intermediate processing while preventing unintentional division during transportation or storage.
2Manufacturing precision
If the breaking step is performed immediately after forming a scribe line, then the division position is accurately defined, but the substrate cannot be processed in between and may require immediate transportation or storage
Solution Approach 1:
The trench line is formed as a preliminary structure that precisely defines the division position, but the actual crack formation is delayed. This allows intermediate processing steps to be scheduled flexibly between trench line formation and the breaking step, improving productivity while maintaining manufacturing precision through the pre-defined trench line position.
3Manufacturing precision
If a vertical crack is formed during processing of the brittle substrate, then the division position is established, but the crack may penetrate further in the thickness direction unintentionally and separate the substrate
Solution Approach 1:
The division process is segmented into two distinct stages: first forming a trench line that defines the division position without creating a through-crack, and then separately forming the vertical crack during the breaking step. This segmentation allows precise position control through the trench line while maintaining substrate integrity during intermediate processing, as the crack is only formed when intentionally triggered.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents unintentional division of brittle substrates during transportation or processing by maintaining a crack-free state until the defined trench line is used to form a crack line, allowing precise control over the division process.
Implementation Method 1
The cutter slides or rolls on the substrate, thus forming a trench on the substrate through a plastic deformation
Implementation Method 2
Subsequently, a stress is applied to the substrate in a step referred to as a breaking step. The crack fully penetrates in the thickness direction in the breaking step, so that the substrate is divided.
Data Source
Figure 1(A)~1(E)
Figure 2(A)~2(E)
Figure 3(A)~3(B)
AI summary
A cutter edge (51) is caused to slide to generate a plastic deformation on a first surface (SF1) of a brittle substrate (4), thus forming a trench line (TL). The trench line (TL) is formed so as to obtain a crack-free state in which the brittle substrate (4) seamlessly continues in a direction intersecting the trench line (TL) directly below the trench line (TL). The crack-free state is then maintained. A crack of the brittle substrate (4) in its thickness direction is extended along the trench line (TL) to form a crack line (CL). The brittle substrate (4) is divided along the crack line (CL).