Broad-Spectrum LED Package Layout for Tunable UV-Visible-IR Emission
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Solution Overview
Problem
Conventional LED packages face challenges in achieving high light emission efficiency due to internal reflection and absorption, and they require complex systems with multiple light sources and components for broadband electromagnetic spectrum emissions.
Innovation Solution
The development of LED packages that incorporate multiple LED chips on a submount, each emitting different peak wavelengths across a broad electromagnetic spectrum, including ultraviolet, visible, and infrared ranges, with a single encapsulant forming a lens to enhance light extraction and control schemes for independent activation of each chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED chips are arranged in close proximity on a common submount to achieve broadband emissions, then the spectral coverage is improved, but the device complexity increases
Solution Approach 1:
Multiple LED chips emitting at different peak wavelengths are integrated onto a single common submount, merging multiple light sources into one device. This achieves broadband spectral coverage (from UV to IR) while consolidating what would otherwise be separate systems into a single integrated package, thereby improving versatility without proportionally increasing complexity.
Solution Approach 2:
The common submount serves multiple functions simultaneously: it provides mechanical support for multiple LED chips, electrical connections for all chips, thermal management for the array, and optical encapsulation. This multi-functionality approach allows broadband emissions to be achieved without adding proportional complexity, as one component structure accomplishes multiple tasks.
2Device complexity
If a single encapsulant is used to cover multiple LED chips, then the device complexity is reduced, but the light extraction efficiency may be compromised
Solution Approach 1:
The single encapsulant is formulated with specific optical properties (refractive index, transparency) that are optimized for the broadband wavelength range. By tailoring the encapsulant material's local optical characteristics to match the requirements of multiple LED chips with different peak wavelengths, efficient light extraction is maintained across the entire spectral range while using a unified encapsulation structure.
3Adaptability or versatility
If multiple colored LED chips are used to achieve broadband emissions, then the spectral tunability is improved, but the electrical control complexity increases
Solution Approach 1:
The array of LED chips is divided into distinct functional groups or zones on the submount, each group containing chips with similar electrical characteristics (forward voltage, current requirements). This segmentation allows for simplified electrical control by treating each zone as a controllable unit, reducing the overall control complexity while maintaining the ability to independently activate specific wavelength regions for spectral tuning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These packages enable efficient broadband spectral emissions with dynamic tuning capabilities, reducing the need for complex systems and improving light output quality by allowing for precise control and combination of peak wavelengths within a single light source.
Implementation Method 1
When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions
Implementation Method 2
Light emissions that exit surfaces of LED emitters may then interact with elements or surfaces of corresponding LED packages, thereby increasing opportunities for reflections and/or light loss
Data Source
AI summary
Light-emitting diode (LED) packages, and more particularly broad electromagnetic spectrum LED packages are disclosed. Individual LED packages are disclosed that are capable of emitting various combinations of peak wavelengths across a broad electromagnetic spectrum, including one or more combinations of ultraviolet, visible, and infrared peak wavelengths. Such LED packages may also be broadly tunable across portions of the electromagnetic spectrum ranging from ultraviolet to infrared wavelengths. By providing such capabilities within a single light source provided by a single LED package, larger and more complex systems for broadband emissions that include multiple light sources, complex optical systems, mirrors, filters, and additional components may be avoided. LED chip arrangements, control schemes, and encapsulant arrangements are also disclosed for such broad electromagnetic spectrum LED packages.